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MORE THAN 350 HIGHLIGHTS
TECHNICAL PAPERS n 41 technical sessions
COVERING: including:
Fan-Out WLP & CSP • 5 interactive
Don’t Miss Out on the 3D & TSV Processing presentation sessions,
Industry’s Premier Event! Heterogeneous Integration including one featuring
student presenters
Fine Pitch Flip-Chip
The only event that MEMS & Sensors n 18 CEU-approved
Professional Development
encompasses the Advanced Substrates Courses
diverse world of integrated Advanced Wire Bonding n Technology Corner Exhibits,
featuring more than 100
systems packaging. Flexible & Wearable Devices industry-leading vendors
RF Components
Automotive Electronics n 6 special invited sessions
For more information, visit:
www.ectc.net Bio/Medical Devices n Several evening receptions
Harsh Environment
n 3 conference luncheons
Conference Sponsors: Official Media Sponsor: Thermal/Mech Simulation n Multiple opportunities for
Interconnect Reliability networking
Optical Interconnects n Great location

Following this procedure, the machine can be switched back to References
cryo pump mode to achieve UHV conditions, thereby opening up 1. https://www.schott.com/epackaging/english/auto/others/
the possibility for surface-activated bonding (SAB) applications. hermes.html
2. https://silexmicrosystems.com/mems-foundry/key-
Summary technologies/sil-via-tsv/
The following conclusions can be made from the data 3. A. Hilton, et al., “Wafer-level vacuum packaging
presented in this work: of microbolometer-based infra-red imagers,” 13th
International Wafer Level Packaging Conf. (IWLPC), Oct.
• The AWB system is well-suited for wafer-level vacuum 18-20, 2016, San Jose, CA, USA.
encapsulation of MEMS; 4. T. Rogers, “The use of in situ chemistry for improved
• Numerous wafer-bonding processes exist that can be used wafer bonding,” presented at WaferBond 2011, Dec. 6-8,
to achieve vacuum encapsulation; 2011, Chemnitz, Germany.
• The support infrastructure exists for procurement of 5. N. Saeidi, T. Rogers, A. Draisey, R. Davies, D. Casey,
items such as feedthrough wafers and getter materials that C. Colinge, et al., “The effects of in situ formic acid
facilitate wafer-level vacuum encapsulation; treatment on oxide reduction for copper wafer bonding,”
• The AWB system is suitable for MEMS applications WaferBond 2011, Dec. 6-8, 2011, Chemnitz, Germany.
requiring encapsulated vacuum levels of <10 mbar; and
-2
• For UHV applications, a cryo-pumped version of the
AWB bonder is available.

Biographies
Tony Rogers is Technical Director and a founder of Applied Microengineering Limited, Didcot, Oxfordshire,
UK. He graduated with a 1st class honors degree in Applied Physics from Brunel U. in 1976 and has spent the
majority of his career working in MEMS, with a focus on wafer bonding. Mainly working on development
of new bonding processes and equipment, Tony has also written and presented numerous articles on wafer
bonding. Email Tony@aml.co.uk
Anna Draisey is an Application Engineer at Applied Microengineering Limited, Didcot, Oxfordshire,
UK. She received her MSc degree in Electronics Engineering, MEMS faculty, in 2006 from Wroclaw U. of
Technology in Poland. Since 2008, Anna has been working for AML, has extensive experience in wafer bonding and is involved
in R&D on bonding processes and development of Aligner Wafer Bonder machines. Anna works closely with AML customers
on bonding demonstrations, training and customer support.

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