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INDUSTRY NEWS ADVERTISER INDEX

Amkor Technology www.amkor.com .......... 1
TestConX 2020 Preview Brewer Science
www.brewerscience.com ..................... 43
Ira Feldman, General Chair Chip Targets www.chiptargets.com .......... 7

TestConX returns to Mesa, Arizona Integration, test engineers and test Contech Solutions
www.contechsolutions.com ................... 44
on March 1-4, 2020 for its 21st year. The solution providers need to understand
workshop focuses on connecting electronic not just the configuration of the device to DL Technology www.dltechnology.com ..... 41
test professionals to solutions. And this be tested but the packaging technology
year is no exception with the hottest topics itself. Ross Berntson, President and COO E-tec Interconnect www.e-tec.com ....... 32
being 5G and millimeter-wave testing. As of Indium Corporation, will provide ECTC www.ectc.net ............................ 46
the mobile operators build out 5G networks the keynote address “Materials Science
and consumer demand increases for Innovation in Advanced Packaging” EV Group www.evgroup.com ................... 2
compatible smartphones, manufacturers describing new enabling interconnect and
have started to build the supply of next thermal technology. Indium Corporation
generation baseband solutions. Not only are Other technical sessions at TestConX www.indium.com/HIA ............................ 35
the silicon die challenging to test at mm- 2020 include printed circuit board (PCB) Ironwood Electronics
wave frequencies many are being deployed design and fabrication for test applications, www.ironwoodelectronics.com ............... 39
in Antenna-in-Package (AiP) advanced silicon validation, test cell integration, signal
packaging that incorporates one or more integrity, thermal challenges for test, and Johnstech www.johnstech.com ........... IBC
antennas. Testing just the die is usually contact solutions. The tutorial program on
insufficient and robust test solutions need to Sunday includes three presentations: two on LB Semicon www.lbsemicon.com ............ IFC
be developed and deployed to test the device big-data and machine learning for test and Leeno Industrial www.leeno.com ............ 16
in the AiP. TestConX 2020 will feature two one on socketing for mm-wave applications.
technical sessions on mm-Wave and AiP Sixty-one exhibitors will show the latest Meptec www.kgdworkshop.org ............... 48
test solutions. in test consumables and hardware at the
As the number and types of advanced popular TestConX EXPO. Add a poster Micro Control www.microcontrol.com ..... 30
packaging are rapidly increasing in the era session, numerous networking breaks, and a Onto Innovation
of More Than Moore and Heterogenous social event to round out the four-day event. www.ontoinnovation.com ................... OBC
PacTech www.pactech.com ................... 15

Plasma Etch www.plasmaetch.com ......... 34
Precision Contacts
www.precisioncontacts.com ..................... 29
SEMI
www.semi.org/en/collaborate/standards .... 47

Smiths Interconnect
www.smithsinterconnect.com ............. 27
Sonix www.sonix.com ......................... 7
SÜSS MicroTec www.suss.com ............ 23

Test Tooling Solutions Group
www.tts-grp.com .................................. 34
Winway Technology
www.winwayglobal.com ............................ 20
Yield Engineering Systems
www.yieldengineering.com/csr ............... 11

March April 2020
Space Close March 13th
Materials Close March 17th

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48 Chip Scale Review January • February • 2020 [ChipScaleReview.com]
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