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high production throughput to support
the GaN AuSn eutectic process. The
machines also support the AuSi eutectic
process by using different pre-heat
and eutectic temperatures and can be
configured to add epoxy dispensing and
epoxy stamping. Our fully-automated
solution for RF power amplifier device
manufacturing meets the challenges
posed by the accelerated deployment of
5G at an attractive return on investment
for users.

References
1. M. Di Paolo Emilio, “RF power
semiconductors for 5G shift to
WBG materials,” September 4,
2020, Electronic Products.
2. Mark LaPedus, “Power Amp Wars
Begin For 5G,” Aug. 24, 2020,
Semiconductor Engineering.
3. “GaN RF market applications,
players, technology, and substrates
2020,” Yole Développement report,
May 2020.
4. Paul Shepard, “Pressureless sinter
joining for next-gen GaN & SiC
power semis,” Sept. 01, 2017,
EEPower.
5. H. Yang, et al., “Improvement of
sintering performance of nanosilver
paste by tin doping, 22 Jan. 2020, J.
of Nanomaterials.
6. XiaominWang, et al., “Pressureless
sintering of nanosilver paste as
die attachment on substrates with
Figure 4: Voiding results by scanning acoustic microscope results for the five samples. ENIG finish for semiconductor
images show that all of the 15 samples of Summary applications,” Volume 777, 10 Mar.
the solder flowed evenly without oxidation. We have developed a highly flexible 2019, pp.: 578-585, J. of Alloys and
After the build, five samples were automation solution to support multi- Compounds.
tested for voiding through the use of a die, multi-process production for RF PA 7. K. S. Siow, Die-Attach Materials
scanning acoustic microscope (SAM). devices for 5G base station applications. for High Temperature Applications
The average total void is 1.6% and the The tests show that the machines in Microelectronics Packaging,
average single void is 0.89%. The results achieve high die bonding accuracy Materials, Processes, Equipment,
are shown in Figure 4. and very low void percentage with and Reliability, pub. Springer, 2019.

Biographies
Limin Zhou is a Senior Director of Strategic Marketing at MRSI Systems, Mycronic Group, MA, USA.
Prior to joining the company in 2019, he was Senior R&D Director at NeoPhotonics, China, NPI & Product
Engineering Director in Oclaro Asia, and NPI Operation Director in both JDSU and SAMN-SCI China. He
also worked in Sebit as co-founder of a start-up laser company. His career began at Chartered Semiconductor.
He has a PhD in Automation from Xi’an Jiaotong U.; Email limin.zhou@mycronic.com
Julius R. Ortega is a Principal Applications Engineer at MRSI Systems, Mycronic Group, MA, USA. He
joined the company in 2000 and started his career at Texas Instruments (Baguio City, Philippines) as Test Equipment Engineer
(Manufacturing); he was also a Field Service Support Engineer for Schlumberger (Semiconductor Test and Assembly Division)
supporting Intel (Philippines, Malaysia & Israel) Asia. He has a BS in Electronics & Communications Engineering from Saint
Louis U. (Baguio City, Philippines).

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