Page 6 - ChipScale_Jan-Feb_2021-digital

FROM THE EDITOR

The wonders of quantum computing

By Debra Vogler, Sr. Technical Editor

W hen I first laid eyes on 1) “Post-Moore’s Law electronics: now, experts to, once again, put forth the vision

In 2021, CSR will be asking industry
the IBM Q System One
until quantum electronics,” (R.
computer (an “integrated
Heterogeneous integration will continue
universal approximate Tummala/Georgia Tech, Mar/Apr); that will drive the packaging and test sectors.
quantum computing system” according to 2) AI’s impact on 3D packaging: to play a major role and, as semiconductor
IBM’s news release) at SEMICON West heterogeneous integration,” (S. processes continue to show signs of blurring
2019, I was stunned. I had seen photos of it Ku mar/ Yole Développement, the boundaries between front-end-of-line,
beforehand, but in person—it was a “wow” Korea, May/June); middle-end-of-line, and back-end-of-line,
moment. I felt the same way I did as a kid there will undoubtedly be more blurring
when President Kennedy challenged the 3) “Electronic packaging for future of the lines among our standard coverage
nation to land a man on the moon—and electronic systems,” (M. Töpper, topics. QC will continue to be a topic of
then watched it happen less than 10 years T. Braun, R. Aschenbrenner/ significant interest. In our first issue of
later. When quantum computing (QC) was Fraunhofer IZM, Jul/Aug); the new year, members of the Quantum
discussed at IWLPC 2019, I felt challenged Information and Integrated Nanosystems
as senior technical editor of this magazine 4) “Enabling AI with heterogeneous Group at MIT Lincoln Laboratory (R. Das,
to solicit content from industry experts integration,” (N. Fan/ASM Pacific V. Bolkhovsky, A. Wynn, R. Rastogi, S.
that would tackle the impact of QC and Technology Ltd., Sept/Oct); Zarr, L. Johnson) present their strategy for
applications such as artificial intelligence using laser direct write (LDW) and optical
(AI) on the future of packaging and test. 5) “A deep-learning solution for lithography to fabricate 200mm wafer-
(While AI also uses classical computing, heterogeneous package inspection,” scale superconducting multi-chip modules
it will benefit from QC capabilities as that (S . C h i t c hi an / I NTE K PLU S (S-MCM) for interconnecting multiple active
technology is further developed.) Corporation Ltd., Sept/Oct); superconducting flux quantum (SFQ) chips
for next-generation cryogenic processing
Industry experts heeded Chip Scale 6) “Enabling AI with heterogeneous systems. The authors note that, “the demand
Review’s call for QC/AI/next-generation i nteg rat ion,” (A. Ku ma r, M. for superconducting computing scalability
computing content, and as a result, we Farooq/IBM Research, Nov/Dec). beyond arrays of a few superconducting
were able to publish several relevant chips is driving the need for greater wiring
articles in 2020 that included: densities and more functionality onto a
single cryogenic package.”
As the industry continues implementation
of QC and AI, I look forward to receiving
abstracts from our long-time authors, as
well as those who have not written for
CSR before. Our readers need articles
that shed light on the challenges with
respect to packaging qubits, such as:
reducing electromigration (EM) loss, the
impact of dielectric loss on how to scale
wiring layers, the impact of a low thermal
budget for Josephson junctions (JJs), and
developing superconducting through-
silicon vias (TSVs), among others (ref.:
“Fabricating Quantum Technologies,” G.
Ribeill/Raytheon Technologies, SEMICON
West 2020).

Computing performance driven by Moore’s Law and post-Moore’s Law technologies. SOURCE: “Post-Moore’s Here’s looking to innovation (and to
Law electronics: now, until quantum electronics,” (R. Tummala, Chip Scale Review, Mar/Apr 2020) better times) in 2021.

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