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CONTENTS
January • February 2021 DEPARTMENTS
Volume 25, Number 1
4 FROM THE EDITOR
The wonders of quantum computing
By Debra Vogler, Sr. Technical Editor
[Chip Scale Review]
7 TECHNOLOGY TRENDS
Heterogeneous integration prompts test
content to “shift left”
By Dave Armstrong
Cover image represents bare die on [Advantest America, Inc.]
a wafer. These die were used in the
assembly of a MEMS package, which was
integrated into a pressure sensor. MEMS
are responsible for the sensing element of 54 TECHNOLOGY TRENDS
heterogeneous integration and are one of Adhesive bonding for flexible microLED
many application types that will advance display assembly
tremendously by leveraging intricate
multi-die designs to deliver greater By Goutham Ezhilarasu, Subramanian Iyer [UCLA]
performance in a more compact footprint. Ajit Paranjpe [Veeco Instruments, Inc.]
Jay Lee [DISCO Corporation]
Photo courtesy of Universal Instruments Frank Wei [DISCO Hi-Tec America, Inc.]
Chip Scale Review January • February • 2021 [ChipScaleReview.com] 1 1
