Page 54 - ChipScale_Sep-Oct_2020-digital

ADVERTISER INDEX
STATEMENT OF OWNERSHIP,
Accretech America MANAGEMENT AND CIRCULATION
www.accretech.jp/english/index.html ....... 4 (All Periodicals Publications Except Requester Publications)

Amkor Technology www.amkor.com ..... 1 1 Publication Title: Chip Scale Review
2 Publication Number: 1526-1344
The seventh IEEE Applied Materials 3 4 Filing Date: 10/1/2020
Issue Frequency: Bi-Monthly
International www.amat.com .................................. OBC 5 6 Number of Issues Published Annually: 6
Annual Subscription Price: $125/Year, $225/year international
Workshop on Brewer Science 7 Mailing Address of Known Office of Publication:
12455 Watsonville Road, Gilroy, CA 95020
www.brewerscience.com ...................... 38
Contact Person: Kim Newman, 408.846.8580
testing three- 8 Complete Mailing Address of Headquarters or General Business
Office of Publisher (Not printer):
dimensional, chiplet-based, Chip Targets www.chiptargets.com ..... 45 9 12455 Watsonville Road, Gilroy, CA 95020
Publisher: Kim Newman
and stacked ICs, 3D & Contech Solutions PO Box 2165 Morgan Hill, CA 95038
Editor: Debra Vogler
www.contechsolutions.com .................. 32
chiplets test virtual workshop 74-478 Hwy 111 #363
Palm Desert, CA 92260
Managing Editor: Lawrence Michaels
and continuation of the DL Technology 10 Owner: Haley Publishing Inc.,
PO Box 2165 Morgan Hill, CA 95038
www.dltechnology.com ........................ 34
popular 3D-TEST Workshop E-tec Interconnect www.e-tec.com ...... 47 PO Box 2165 Morgan Hill, CA 95038
Known Bondholders, Mortgagees and Other Security Holders
11
will be held in conjunction Owning or Holding 1 Percent or More of Total Amount of Bonds,
Mortgages or Other Securities: None
with ITC / Test Week 2020 on EV Group www.evgroup.com ............ 2 12 Tax Status: Has not changed during preceding 12 months
Publication Title: Chip Scale Review
13
November 6, 2020. FormFactor 14 Issue Date for Circulation Data Below: Issue Date for Circulation
Data Below: July - August 2020
www.formfactor.com/go/ap .................... 22
Average No.
15
Extent and Nature of Publication

of Single
Copies Each No. Copies
Issue During Issue
Published
Preceding
The 3DC-TEST Workshop focuses Indium Corporation 12 Months to Nearest to
exclusively on test of and design-for-test www.indium.com/SiP/CSR ..................... 12 Filing Date Filing Date
for three-dimensional, chiplet-based, Ironwood Electronics a Total Number of Copies 12,331 12,100
(Net Press Run)
and stacked ICs (3D-SICs), including www.ironwoodelectronics.com ........... 41 b Paid and/or Requested Circulation 0 0
systems-in-package (SiP), package- (1) Paid Requested Outside- 0 0
County Mail Subscriptions on
on-package (PoP), and 3D-SICs based Johnstech www.johnstech.com ......... IBC (2) Form 3541
Paid In-County Subscriptions
on through-silicon vias (TSVs), micro- (Form 3541) 0 0
bumps, and/or interposers. While Kulicke & Soffa www.kns.com .......... IFC (3) Sales Through Dealers and
Carriers, Street Vendors,
these stacked ICs offer many attractive Counter Sales and Other Non- 0 0
advantages with respect to heterogeneous LB Semicon (4) USPS Paid Distribution
www.lbsemicon.com .............................. 10
Other Classes Mailed
integration, small form-factor, high Through the USPS 0 0
0
0
bandwidth and performance, and low MRSI Systems c d Total Paid and/or Requested Circulation 11,790 11,497
Free Distribution by Mail
power dissipation, there are many open www.mrsisystems.com ................... 15 (1) Outside-County (on Form 3541) 0 0
issues with respect to testing such (2) In-County (on Form 3541) 11,790 11,497
Other Classes Mailed Through
(3)
products. Plasma Etch www.plasmaetch.com .... 40 the USPS 0 0
The 3DC-TEST Workshop offers (4) Free or Nominal Rate 585 603
Distribution Outside the Mail
a forum to present and discuss these SEMI www.semi.org/semiismore .......... 36 e Free Distribution Outside the Mail 0 0
challenges and (emerging) solutions Smiths Interconnect f Total Free Distribution (Sum of 15c 11,790 11,800
and 15e)
among researchers and practitioners www.smithsinterconnect.com ............. 20 g Copies Not Distributed 346 303
alike. 3DC-TEST will take place in h Total (Sum of 15f and g) 12,136 12,103
conjunction with the IEEE International Sonix www.sonix.com ......................... 44 i. j. Percent Paid 0 0
Percent Paid and/or Requested
Test Conference (ITC) and is sponsored Circulation (15C divided by 0.00 0.00
15G times 100)
by the IEEE Philadelphia Section in SÜSS MicroTec www.suss.com ...... 25 16 This Statement of Ownership will be
concurrence with the Test Technology printed in the September - October
2020 issue of this publication.
Technical Council (TTTC). WinWay Technology a Paid Electronic Copies 0 0
www.winwayglobal.com ...................... 26 b Total Paid Print Copies (Line 15c)
+ Paid Electronic Copies (Line 16a) 0 0
Key dates and deadlines: Xperi Invensas www.invensas.com ..... 16 c Total Print Distribution (Line 15f) 0 0
• Submission deadline: September 28th d + Paid Electronic Copies (Line 16a)
Percent Paid (Both Print & Electronic
• Notification of acceptance: October 1 Yield Engineering Systems Copies) (16b divided by 16c Í 100) 0 0
• Early registration deadline: October 5th www.yieldengineering.com .................... 7 I certify that 50% of all my
distributed copies (electronic
• Camera-ready material: October 23rd and print) are paid above a
nominal price.
For additional information: November December 2020 17 Publication of Statement of Ownership x the publication is a general
publication, publication of
Visit: www.3dtest.tttc-events.org this statement is required.
Will be printed in the
Contact: Erik Jan Marinissen, imec Space Close November 6th September October 2020
issue of this publication.
General Co-Chair Materials Close November 13th 18 Signature and Title of Editor, Publisher, Kim Newman, Publisher
Tel.: +1 32 16-288755 Business Manager, or Owner Kim Newman
E-mail: erik.jan.marinissen@imec.be For Advertising Inquiries I certify that all information furnished on this form is true and complete. I
understand that anyone who furnishes false or misleading information on
ads@chipscalereview.com this form or who omits material or information requested on the form may
be subject to criminal sanctions (including fines and imprisonment)
and/or civil sanctions (including civil penalties).
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