Page 53 - ChipScale_Sep-Oct_2020-digital

INDUSTRY NEWS

Register now for the 17th annual IWLPC recognized as the
premier semiconductor packaging conference and exhibition
focused on advanced wafer-level packaging technology.

This year’s conference theme, “Bridging the Boundaries: Wafer, Panel and Beyond” reflects the role of advanced wafer level
packaging in the enablement of 5G communications, AI, and IoT, automotive and more.
The IWLPC has always provided a dynamic environment for learning, networking and technical exchange and this year will be no
different. Well, maybe a little different. The 2020 conference will be the first IWLPC to be held virtually. The conference committee has
arranged for a high-quality virtual conference experience to deliver the technical content and to facilitate communication and networking.
As in prior years, the conference comprises three major parts: the technical program, the professional development courses, and the
technology exhibition. The technical program has three parallel tracks with approximately 50 presentations on wafer-level packaging, 3D
integration, and advanced manufacturing and test technologies. This year the technical presentations will be available on demand from
October 13 through October 30. A chat feature will enable attendees to interact with the speakers, exhibitors and other attendees.
The 2020 IWLPC will kick off with a keynote talk titled “Trends, Challenges, Opportunities in Advanced Packaging for Smart
Computing Era” given by Dan Oh, Ph.D., Engineering VP of Test & System Package (TSP), Samsung Electronics. Dr. Oh’s speech will be
broadcast live at Tuesday, October 13, 2020 at 9:00 am PDT.
In addition, Jan Vardaman of TechSearch International will moderate a LIVE panel discussion entitled “Meeting Future Advanced
Packaging Challenges: What’s Next?”
This event will be live on Wednesday, October 14 @ 9:00am PDT.
As the industry moves into the next silicon nodes and enters the era of heterogeneous integration, packaging plays an increasingly
important role. Material selection, design, and fabrication of features, inspection, test, and reliability will be critical. The industry
struggles with options to achieve high-density substrate to support high-bandwidth memory (HBM) plus logic. New versions of FO-
WLP are being adopted. The panel members will discuss views on the challenges and possible solutions. Don’t miss this once in a lifetime
international panel discussion!
Panel members are:

For more about the panelists: www.smta.org/mpage/iwlpc-panel
Finally, the technology exhibition this year will feature many leading companies from across the advanced packaging supply chain.
Attendees will be able to browse the virtual exhibition hall and engage in live chat sessions with the exhibitors. We look forward to seeing
you this October in cyberspace.

For additional information and conference details: www.iwlpc.com
• Conference information: Jaclyn Sarandrea – jaclyn@smta.org
• Exposition information: Mckenna Hill – mckenna@smta.org

Participating Sponsors

51
Chip Scale Review September • October • 2020 [ChipScaleReview.com] 51