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CONTENTS
The Future of Semiconductor Packaging
STAFF
Kim Newman
Publisher
knewman@chipscalereview.com
Lawrence Michaels
Managing Director
Editor-in-Chief
lmichaels@chipscalereview.com
Debra Vogler
Senior Technical Editor
dvogler@chipscalereview.com 33
SUBSCRIPTION—INQUIRIES FEATURE ARTICLES (continued)
Chip Scale Review
All subscription changes, additions, deletions to any
and all subscriptions should be made by email only to 25 Readying the supply chain for chiplets and heterogeneous
subs@chipscalereview.com
IC packaging
By Mike Kelly, Dave Hiner, Ruben Fuentes, Jonathan Micksch,
Advertising Production Inquiries: Vineet Pancholi [Amkor Technology, Inc.]
Lawrence Michaels
lmichaels@chipscalereview.com
33 Making the golden connections in 3D-IC system level-design
Copyright © 2024 Haley Publishing Inc. By Tarek Ramadan [Siemens EDA]
Chip Scale Review is a registered trademark of Haley Publishing Inc.
All rights reserved.
Subscriptions in the U.S. are available without charge to qualified
individuals in the electronics industry. 39 Exploring bond strength for an advanced chiplet with
Chip Scale Review is published six times a year with issues in hybrid bonding
January-February, March-April, May-June, July-August,
September-October and November-December. By Junya Fuse, Tomoya Iwata, Yuki Yoshihara, Marie Sano, Fumihiro Inoue
[YOKOHAMA National University]
P.O. Box 2165
Morgan Hill, CA 95038
Tel: +1-408-846-8580
E-Mail: subs@chipscalereview.com
46 Scaling up GaN- and InP-based technologies
Printed in the United States
for 5G & 6G wireless communication
By Nadine Collaert [imec]
46
Chip Scale Review January • February • 2024 [ChipScaleReview.com] 3 3
