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CONTENTS
Volume 28, Number 1
January • February 2024
Heterogeneous chiplet integration to make megachips 13
The megachip approach helps to rearchitect heterogeneous chip tiling for developing highly complex systems having desired circuit density
and performance. Recent work on large-area superconducting integrated circuits to join multiple individual die is highlighted in this article,
with particular attention paid to the processing of the high-density electrical interconnects formed between the individual die.
Cover image courtesy of iStock/NiPilot
DEPARTMENTS
EXECUTIVE VIEWPOINT
7 Backside power delivery: The new frontier for wafer bonding
By Paul Lindner [EV Group]
TECHNOLOGY TRENDS
10 The great lithography debate: Copper clad laminate
or glass substrates?
By Doug Brown [Onto Innovation]
FEATURE ARTICLES
13 Heterogeneous chiplet integration to make megachips
By Rabindra N. Das, Jason Plant, Alex Wynn, Matthew Ricci, Ryan Johnson,
Matthew Stamplis, et al. [MIT Lincoln Laboratory]
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