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Volume 27, Number 3
May • June 2023
The Future of Semiconductor Packaging
FEATURE ARTICLES [continued]
STAFF
Kim Newman
Publisher 29 INTERNATIONAL DIRECTORY DEFECT INSPECTION SYSTEMS
knewman@chipscalereview.com By Chip Scale Review Staff
Lawrence Michaels
Managing Director/Editor
lmichaels@chipscalereview.com 37 Slipping IC package design schedules and what to do about it
By Keith Felton
Debra Vogler [Siemens Digital Industries Software]
Senior Technical Editor
dvogler@chipscalereview.com
42 Achieving automated shmoo results analysis with a
deep learning method
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