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May • June 2023 CONTENTS
Volume 27, Number 3
FEATURE ARTICLES
7 High-performance, multi-chip leadframe package with
internal connections
By DaeYoung Park, HyeongIl Jeon, GiJeong Kim, JiYeon Yang,
KwangSoo Sang, ByongJin Kim, JinYoung Khim
[Amkor Technology Korea, Inc.]
15 TSV oxide etch-back optimization for the via-last
The drivers of semiconductor packaging integration scheme
technologies include meeting the packaging By Bhesetti S. S. Chandra Rao, Hemanth K. Cheemalamarri,
performance requirements for applications Darshini Senthilkumar
related to artificial intelligence (AI) processors, [Institute of Microelectronics, Agency for Science, Technology and
high-performance computing (HPC) and high- Research (A*STAR)]
bandwidth memory (HBM), datacenter devices,
network processors, and virtual reality devices.
Related to the demand for AI and HPC are 23 Illumination inspection technology for defect detection
supply chain issues for advanced IC substrates.
Articles in this issue offer solutions to some of on advanced IC substrates
these challenges. By Cheolkyu Kim, Burhan Ali, JungHyun Kim
[Onto Innovation]
Cover image courtesy of iStockphoto/jiefeng jiang Jong Eun Park, Misun Hwang, Chan Jin Park
[Samsung Electro-Mechanics (SEMCO)]
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