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Volume 26, Number 4
July • August 2022
The Future of Semiconductor Packaging
STAFF FEATURE ARTICLES
Kim Newman
Publisher 12 Vertically-integrated packaging solutions driven
knewman@chipscalereview.com
by innovations
Lawrence Michaels By Mark Gerber, Lihong Cao, Vikas Gupta, Patricia MacLeod [ASE, Inc.]
Managing Director/Editor
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23 A 55GHz octal-site probe card for 5G mmWave devices
Debra Vogler By Peter Cockburn [Cohu, Inc.]
Senior Technical Editor
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31 Advancing 5G communications using LTCCs
By Andy Kao [DuPont]
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Lawrence Michaels 39 Improving semiconductor packaging with advanced silicones
lmichaels@chipscalereview.com By Jayden Cho, Roderick Chen [Dow]
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