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CONTENTS

        July  •  August 2022
        Volume 26, Number 4
                                              DEPARTMENTS

                                                TECHNOLOGY TRENDS
                                                   7  Overcoming thermal wafer test challenges for SoC and
                                                      chiplet stacks
                                                      By Markus Kindler  [ATT-Systems]  Amy Leong  [FormFactor Inc.]


                                                EXECUTIVE VIEWPOINT

         ASE’s advanced packaging is based       36   The American Industrial Compact Consortium seeks to
         on six critical packaging technologies.      spark innovation and investment
         These technologies are built upon an         By Brian Long  [American Industrial Compact Consortium]
         open silicon ecosystem in partnership
         with foundries, component suppliers, and
         across the supply chain. Furthermore,
         these technologies provide the capabilities
         necessary to enable highly-integrated
         silicon packaging solutions.

         Cover image courtesy of ASE, Inc.



















































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