Page 54 - Chip Scale Review_May June_2022-digital

Many semiconductor packaging solution printable sintering paste, the design of an analysis 2022-2030,” Allied Market
providers will set up different local optimal printing area within the HPE will Research, Jan. 2022. Retrieved
laboratories to update their customers on avoid issues such as smearing, uneven paste Feb. 23, 2022, from https://www.
the initial development and characterization printing and offsetting of printed paste. alliedmarketresearch.com/electric-
of the important processes for the complete Applying a uniform force and pressure vehicle-market#:~:text=The%20
HPE modules in manufacturing. It also during clip placement followed by pressure global%20electric%20vehicle%20
provides a means to work with collaborative clip sintering is also a critical process market,electric%20vehicle%20
critical material (e.g., nano silver paste parameter. The results of using optimal industry%20as%20well.
and ceramic substrate) suppliers for processes for each step of a clip-bonded
characterization and even qualification HPE is a high-quality sintered clip bond Biography
purposes. This action will help accelerate that is robust enough to handle the influx of Eric Kuah, DBA, is VP of Technology
the industry’s technology development stress when subjected to high thermal load APET 1-2 at ASM Technology Singapore
and reduce the initial risk for setting up the during actual operation of the HPE. Pte Ltd., Singapore. He has been with ASM
production line. since 1993 and his current responsibilities
Acknowledgments in the APET group include development
Summary The author thanks Nelson Fan, Ding of new technology for encapsulation
Clip sintering is an alter native Jia Pei, Deivasigamani Mouleeswaran, packaging in the IC and LED areas, silver
interconnect to heavy aluminum wire Yuan Bin, Liao Jian, Tim Lu Fei, Wilson sintering, ToF, and active alignment for
bonding when a HPE device or system is Kwok and Eugene Wee of ASM Pacific cameras, and managing a team of engineers
required to transmit high voltage or to allow Technology Ltd. in the various engineering disciplines from
high current to flow. In order to ensure a mechanical to materials engineering. He is
good pressure sintering bond for the clip, Reference a holder of more than 25 US patents. Email
it is crucial to select a sintering paste that 1. A. Jadhav, S. Mutreja, “Electric eric.kuah@asmpt.com
flows easily when applied. In addition to a vehicle market share, growth, size,

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