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Volume 26, Number 2
March • April 2022
The Future of Semiconductor Packaging
FEATURE ARTICLES
STAFF
Kim Newman
Publisher 17
knewman@chipscalereview.com Large-size multi-layered fan-out RDL multi-chip
module packaging
Lawrence Michaels By Nicholas Kao, Jay Li, Jackson Li, Yu-Po Wang
Managing Director/Editor [Siliconware Precision Industries Co., Ltd]
lmichaels@chipscalereview.com
Debra Vogler
Senior Technical Editor
dvogler@chipscalereview.com 27 Embedded chip packaging
By Ray Fillion
[Fillion Consulting]
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