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March • April 2022 CONTENTS
Volume 26, Number 2

DEPARTMENTS

TECHNOLOGY TRENDS
6 A new and historic packaging era
By Rao Tummala, Madhavan Swaminathan, Pratik Nimbalkar
[Georgia Institute of Technology]

EXECUTIVE VIEWPOINT
The chip shown in the picture is a fan- 12
out multi-chip module (FO-MCM). It’s Operating in the eye of the COVID-19 storm
an example of heterogeneous integration By Asif R. Chowdhury [UTAC Group]
fabrication with optimized 2/2μm line/
spacing, multi-layers of redistribution layers
(RDLs) and chip-last technology to supply INDUSTRY NEWS
interconnects between die to die and die to 15 ECTC 2022 will bring key technologists/scientists
high-bandwidth memories. This becomes
a potential platform for applications such as together – in-person!
HPC, AI accelerator and cloud computing. By Karlheinz Bock [TU Dresden]
Scalable routing capability makes this type
of package competitive with respect to one
using a conventional silicon interposer.

Cover image courtesy of SPIL

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