Page 31 - Chip Scale Review_January February_2022-digital

Seriously Fast.

WX3000™ Metrology and Inspection Systems for

Wafer-Level and Advanced Packaging

Copper Pillar

Flip Chip (c4)

2-3X
Faster

Micro Bump

2-3X Faster with High Resolution and High Accuracy

WX3000 3D+2D metrology and inspection system provides the ultimate

combination of high speed, high resolution and high accuracy for wafer-level and
advanced packaging applications to improve yields and processes.

Powered by Multi-Re ection Suppression™ (MRS™) Sensor Technology
The 3-micron NanoResolution (X/Y resolution of 3 micron, Z resolution of 50 nanometer) MRS sensor enables
metrology grade accuracy with superior 100% 3D and 2D measurement performance for features as small as
25-micron. 100% 3D and 2D metrology and inspection can be completed simultaneously at high speed (25 300mm
wafers/hour and 55 200mm wafers/hour) as compared to a slow method that requires two separate scans for 2D and
3D, and only a sampling process.

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