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The Future of Semiconductor Packaging

STAFF
Kim Newman Publisher
knewman@chipscalereview.com Volume 24, Number 1
Lawrence Michaels Managing Director/Editor January • February 2020
lmichaels@chipscalereview.com
Debra Vogler Senior Technical Editor
dvogler@chipscalereview.com
FEATURE ARTICLES
CONTRIBUTING EDITORS
HETEROGENEOUS Steffen Kröhnert - Advanced Packaging 14 Overcoming FOPLP die
steffen.kroehnert@espat-consulting.com
John L. Lau, Ph.D - Advanced Packaging
placement error
INTEGRATION john_lau@unimicron.com Keith Best
Ephraim Suhir, Ph.D - Reliability
[Onto Innovation]
suhire@aol.com
Rao R. Tummala, Ph.D - Advanced Packaging
rao.tummala@ece.gatech.edu
21 Wavefront phase imaging for
EDITORIAL ADVISORS global and local wafer geometry
Andy Mackie, Ph.D (Chair) - Indium Corporation
Rolf Aschenbrenner, Dipl.-Phys. - Fraunhofer IZM Juan M. Trujillo-Sevilla
Arun Gowda, Ph.D - GE Global Research [Wooptix]
John Lau, Ph.D - Unimicron
Leon Lin Tingyu, Ph.D - National Center for Advanced
Packaging (NCAP China) 28 Using laser-induced deep etching to
enable microfeatures in glass
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33 Eliminating warpage for
FOWLP during debonding
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38 Where are we with HDAP LVS
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42 Bonding processes for wafer-scale
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