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HETEROGENEOUS


                            INTEGRATION


































                     GEMINI® FB: Automated Production Wafer Bonding Platform for
                     High-precision Alignment and Fusion Bonding



                     SmartView® NT3 Face-to-face Bond Aligner Offers Industry Leading,
                     Sub-50nm Alignment Accuracy


                     Enabling Leading-edge Applications, Including 3D Stacked CIS, Memory
                     Stacking and Die Partitioning for Next-generation 3D SoC Devices














       GET IN TOUCH to discuss your manufacturing needs
       www.EVGroup.com                                                                            GEMINI® FB XT
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