Page 62 - Chip Scale Review_May June_2021-digital
P. 62
metals, such as aluminum, that may be IEEE Access pp. 154329 - 154337. 7. J-S. Park, et al., “A fully integrated
subject to potential reaction (Figure 10). 2. Sun, et al., “Summarizing CPU and cryo-CMOS SoC for qubit control in
The emphasis in these paste-like GPU design trends with product quantum computers…,” ISSCC 2021,
materials is therefore on their stability, their data,” arXiv:1911.11313v2 [cs.DC] 13 Session 13/13.1.
rheology, and we are currently engaging Jul 2020. 8. D. Saums, et al., “Mechanical
with customers globally to define device- 3. E. Spe rl i ng, Sem iconduct or insertion and reliability testing of
and system-level reliability needs. In many E ng i n e e r i ng , h t t p s : / / TIMs…,” International Symposium
instances, this means going beyond the semiengineering.com/predicting- on Microelectronics (2018) (1):
narrow confines of industry standards, to reliability-at-3-2nm-and-beyond/ 000613–000618.
meet real-life customer expectations for 4. A. Mutschler, Semiconductor 9. J. Ross, et al., Low void solder joint
reliability based on system-level mission E ng i n e e r i ng , h t t p s : / / for multiple reflow applications, US
profiles of use. semiengineering.com/usage-models- Patent 9468136B2.
driving-data-center-architecture- 10. S . C h e n , N . C . L e e , “ H i g h
Acknowledgments changes/ performance thermal interface
The authors wish to thank Tim Jensen, 5. R. Mahajan, et al., “Embedded multi- materials with enhanced reliability,”
Milos Lazic, Ben Rolewicz, Ron Hunadi, die interconnect bridge (EMIB) 2012, 28th Annual IEEE (SEMI-
and Tom Pearson for their helpful – A high density, high bandwidth THERM).
discussions and contributions to this article. packaging interconnect,” 2016 IEEE 11. C. Deppisch, et al., “The material
66th ECTC. opt i m i zat ion a nd reliabilit y
References 6. IEEE HIR: https://eps.ieee.org/ characterization of an indium-solder
1. P. Oldiges, et al., “Chip power- tec h n ol o g y/ h e ter o g e n e o u s - thermal interface material for CPU
frequency scaling in 10/7nm node,” integration-roadmap.html packaging,” JOM, 58, 67-74 (2006).
Biographies
Andy C. Mackie is Principal Engineer and Manager of Thermal Interface Applications Group at Indium
Corporation, Clinton, NY. He holds both a Master’s (Bristol U.) and PhD (Nottingham U.) in Physical
Chemistry. He is a recipient of the iMAPS William D. Ashman Award for Personal Achievement (2014)
and is also Chair of the Editorial Advisory Board, Chip Scale Review Magazine, Chair of the IPC Sintering
Materials Task Group (5-21P), and is on the advisory board of the Automotive Electronics Council (AEC);
email amackie @indium.com
Ross Berntson is President and COO of Indium Corporation, Clinton, NY. He is responsible for global sales, marketing,
technical support, operations, engineering, human resources, and product R&D functions. He has an MBA and a BS (Chemistry)
from Cornell U., where he earned the Henny Wittink Memorial Marketing Prize and the George Caldwell Award.
ADVERTISER INDEX
Advantest www.advantest.com ............................................. 18 Pac Tech www.pactech.de .............................................. 42, 53
Amkor Technology www.amkor.com ........................................... 1 Plasma Etch www.plasmaetch.com ............................................. 46
Brewer Science www.brewerscience.com ...................... 50 Screen Semiconductor Solutions
www.screen.co.jp/spe/en/products .............................................. OBC
CyberOptics www.cyberoptics.com ...................................... 25
SEMI www.semiconsea.org ..................................................... 54
DL Technology www.dltechnology.com ............................... 44
Smiths Interconnect www.smithsinterconnect.com ................ 28
E-tec Interconnect www.e-tec.com ....................................... 56
Sonix www.sonix.com ..................................................... 57
EV Group www.evgroup.com ....................................................... 2
SÜSS MicroTec www.suss.com .......................................... 33
INTEKPLUS Co., Ltd. www.intekplus.com ............................ 22
TSE Co. Ltd www.tse21.com .................................................. 4,5
Ironwood Electronics www.ironwoodelectronics.com ........... 21
Universal Instruments www.uic.com .................................... 39
ISC Co. Ltd. www.isc21.kr ................................................... 47
UTAC Group www.utacgroup.com ............................................ 12
Johnstech International
www.johnstech.com/markets/automotive ................................... IBC WinWay Technology www.winwayglobal.com ....................... 6
LB Semicon www.lbsemicon.com ................................................... 9 Yield Engineering Systems www.yieldengineering.com ............... 15
Leeno Industrial www.leeno.com ....................................... IFC, 34
July August 2021 • Space Close July 6th • Ad Materials Close July 9th • For Advertising Inquiries • ads@chipscalereview.com
60
60 Chip Scale Review May • June • 2021 [ChipScaleReview.com]