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metals, such as aluminum, that may be   IEEE Access pp. 154329 - 154337.  7.  J-S. Park, et al., “A fully integrated
        subject to potential reaction (Figure 10).  2.  Sun, et al., “Summarizing CPU and   cryo-CMOS SoC for qubit control in
          The emphasis in these paste-like      GPU design trends with product     quantum computers…,” ISSCC 2021,
        materials is therefore on their stability, their   data,” arXiv:1911.11313v2 [cs.DC] 13   Session 13/13.1.
        rheology, and we are currently engaging   Jul 2020.                     8.  D. Saums, et al., “Mechanical
        with customers globally to define device-   3.  E. Spe rl i ng, Sem iconduct or   insertion and reliability testing of
        and system-level reliability needs. In many   E ng i n e e r i ng ,  h t t p s : / /  TIMs…,” International Symposium
        instances, this means going beyond the   semiengineering.com/predicting-   on Microelectronics (2018) (1):
        narrow confines of industry standards, to   reliability-at-3-2nm-and-beyond/   000613–000618.
        meet real-life customer expectations for   4.  A. Mutschler, Semiconductor   9.  J. Ross, et al., Low void solder joint
        reliability based on system-level mission   E ng i n e e r i ng ,  h t t p s : / /  for multiple reflow applications, US
        profiles of use.                        semiengineering.com/usage-models-  Patent 9468136B2.
                                                driving-data-center-architecture-  10.  S . C h e n , N . C . L e e , “ H i g h
        Acknowledgments                         changes/                           performance thermal interface
          The authors wish to thank Tim Jensen,   5.  R. Mahajan, et al., “Embedded multi-  materials with enhanced reliability,”
        Milos Lazic, Ben Rolewicz, Ron Hunadi,   die interconnect bridge (EMIB)    2012, 28th Annual IEEE  (SEMI-
        and Tom Pearson for their helpful       – A high density, high bandwidth   THERM).
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                                                66th ECTC.                         opt i m i zat ion a nd reliabilit y
        References                           6.  IEEE HIR: https://eps.ieee.org/   characterization of an indium-solder
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                       Biographies
                         Andy C. Mackie is Principal Engineer and Manager of Thermal Interface Applications Group at Indium
                       Corporation, Clinton, NY. He holds both a Master’s (Bristol U.) and PhD (Nottingham U.) in Physical
                       Chemistry. He is a recipient of the iMAPS William D. Ashman Award for Personal Achievement (2014)
                       and is also Chair of the Editorial Advisory Board, Chip Scale Review Magazine, Chair of the IPC Sintering
                       Materials Task Group (5-21P), and is on the advisory board of the Automotive Electronics Council (AEC);
                       email amackie @indium.com

            Ross Berntson is President and COO of Indium Corporation, Clinton, NY. He is responsible for global sales, marketing,
          technical support, operations, engineering, human resources, and product R&D functions. He has an MBA and a BS (Chemistry)
          from Cornell U., where he earned the Henny Wittink Memorial Marketing Prize and the George Caldwell Award.


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