Page 5 - Chip Scale Review_May June_2021-digital

The Future of Semiconductor Packaging

STAFF Volume 25, Number 3
Kim Newman Publisher May • June 2021
knewman@chipscalereview.com
Lawrence Michaels Managing Director/Editor
lmichaels@chipscalereview.com FEATURE ARTICLES (continued)
Debra Vogler Senior Technical Editor
dvogler@chipscalereview.com
23 Cooling high-wattage digital ICs for
CONTRIBUTING EDITORS socketed system-level test
ACCELERATING Steffen Kröhnert - Advanced Packaging By Rick Marshall, Quynh Nguyen, Tim Wooden,
steffen.kroehnert@espat-consulting.com
Jiachun (Frank) Zhou
John L. Lau, Ph.D - Advanced Packaging
HETEROGENEOUS john_lau@unimicron.com 29 [Smiths Interconnect]
Ephraim Suhir, Ph.D - Reliability
suhire@aol.com
Glass-based quantum photonic packaging
INTEGRATION Rao R. Tummala, Ph.D - Advanced Packaging By Wojciech Lewoczko-Adamczyk, Henning Schröder
rao.tummala@ece.gatech.edu
[Fraunhofer IZM]
EDITORIAL ADVISORS
Andy Mackie, Ph.D (Chair) - Indium Corporation
Rolf Aschenbrenner, Dipl.-Phys. - Fraunhofer IZM 32 Multi-wavelength on-chip coupling
Arun Gowda, Ph.D - GE Global Research of visible light
John Lau, Ph.D - Unimicron By Robert Niffenegger, David Reens
Leon Lin Tingyu, Ph.D - National Center for Advanced [Lincoln Laboratory, Massachusetts Institute of
Packaging (NCAP China) Technology]
Jules Stuart, John Chiaverini
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