Page 3 - Chip Scale Review_May June_2021-digital
P. 3
CONTENTS
May • June 2021 DEPARTMENTS
Volume 25, Number 3
7 GUEST EDITORIAL
Tackling the stressed-out global
semiconductor supply chain
By Carol Handwerker
[Purdue University]
FEATURE ARTICLES
Microscopic image of a MEMSFlex™ 10 A new approach to testing ICs with MEMS
high-density, tight-pitch MEMS probe By Raymond W. Grimm
array manufactured by Nidec SV TCL. [Nidec SV TCL]
The MEMS probe card pictured has a
multi-DUT layout and was fabricated
with over 25,100 fully customized flat-
tipped MEMS probes custom-designed for
force, overdrive, length and tip style to
meet the needs of a particular application Moore’s Law and the future of test
processor with small Cu pillars. 16
By Pooya Tadayon, Greg Iovino, Sameer Ruiwale
Photo courtesy of Nidec SV TCL [Intel Corporation]
Chip Scale Review May • June • 2021 [ChipScaleReview.com] 1 1
