Page 4 - Chip Scale Review_May June_2021-digital
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ACCELERATING


                     HETEROGENEOUS


                              INTEGRATION
























                   EV Group establishes Heterogeneous Integration Competence Center™
                   to accelerate new product development and process integration schemes



                   Wafer-to-Wafer (W2W) and Die-to-Wafer (D2W) hybrid bonding processes
                   ready for sample test, product development and qualification



                   Open access innovation incubator for EVG customers and partners across the
                   microelectronics supply chain, guaranteeing the highest IP protection standards


                   Combining EVG’s world-class wafer bonding, thin-wafer handling and maskless,
                   optical and nanoimprint lithography products and expertise, as well as pilot-line
                   production facilities and services












                                                    GET IN TOUCH to discuss your manufacturing needs
                                                                                    www.EVGroup.com
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