Page 5 - ChipScale_Sep-Oct_2020-digital

The Future of Semiconductor Packaging

STAFF Volume 24, Number 5
Kim Newman Publisher September • October 2020
knewman@chipscalereview.com
Lawrence Michaels Managing Director/Editor
lmichaels@chipscalereview.com
Debra Vogler Senior Technical Editor FEATURE ARTICLES
dvogler@chipscalereview.com Automotive packaging trends: challenges
LITHOSCALE ® CONTRIBUTING EDITORS 14 and solutions
Steffen Kröhnert - Advanced Packaging
steffen.kroehnert@espat-consulting.com
By Thorsten Meyer, Ulrich Abelein, EungSan Cho,
John L. Lau, Ph.D - Advanced Packaging
john_lau@unimicron.com Bernhard Knott, Stefan Macheiner
[Infineon Technologies AG]
MLE™ Maskless Exposure Ephraim Suhir, Ph.D - Reliability
Lithography System suhire@aol.com 21 Enabling artificial intelligence with
Rao R. Tummala, Ph.D - Advanced Packaging
rao.tummala@ece.gatech.edu heterogeneous integration
By Nelson Fan
EDITORIAL ADVISORS
Andy Mackie, Ph.D (Chair) - Indium Corporation [ASM Pacific Technology Ltd.]
Rolf Aschenbrenner, Dipl.-Phys. - Fraunhofer IZM
Arun Gowda, Ph.D - GE Global Research
John Lau, Ph.D - Unimicron 27 FOPLP as a solution for heterogeneous
Leon Lin Tingyu, Ph.D - National Center for Advanced integration
Packaging (NCAP China)
By Michael Hsu
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and all subscriptions should be made by email only to 31 A deep-learning solution for heterogeneous
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package inspection
By Shahab Chitchian
Advertising Production Inquiries: [INTEKPLUS Corporation Ltd.]
Lawrence Michaels
lmichaels@chipscalereview.com
Featuring next-generation digital lithography technology 37 Fluxless TCB of large-area dies with
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