Page 51 - Chip Scale Review_March April_2023-digital

performance scaling. More than 200 Join us as early as Tuesday morning,
experts from broad-ranging technical with three parallel tracks, Heterogeneous
areas have put together an exceptional Integration Roadmap (HIR), ECTC
program consisting of more than 350 Professional Development Courses, and
technical papers in 41 technical sessions, ECTC Special Sessions.
16 Professional Development Courses New this year, we will start every
and several panels, special sessions, and morning at 8:00AM with a single 75min-
networking opportunities to be presented session featuring our Keynote speaker
in 36 oral sessions and 5 interactive on Wednesday, our ECTC Plenary
present ation sessions, i ncludi ng Session on Thursday, and the IEEE EPS
one interactive presentation session Panel Session on Friday. So check-in
exclusively featuring papers by student as early as Monday, and join us for this
authors. The oral sessions will feature exciting conference.
selected papers on key topics such as On Tuesday morning, May 30 at
wafer-level and fan-out packaging, 8:30AM, Tanja Braun, Fraunhofer
2.5D, 3D and heterogeneous integration, I Z M, a nd P r zemyslaw G romala ,
i nt er p oser s , ch iplet s , a dva nc e d Robert Bosch GmbH, will chair the
substrates, assembly, materials and session on Advanced Packaging and Prof. Michael Manfra, Purdue University
thermal modeling, reliability, packaging Heterogeneous Integration Roadmap Applications. On Tuesday afternoon
for harsh conditions, packaging for for Harsh Environment, followed by at 1:30PM, Stéphane Bernabé, CEA
quantum and artificial intelligence (AI) Thomas Gregorich, Infinera, and Chaoqi Leti, and Hiren Thacker, Cisco, will
applications, interconnections, packaging Zhang, Qualcomm, chairing a special host a special session on the topic of
for high-speed and high-bandwidth session at 10:30AM on Copper Hybrid Photonic Integrated Circuit Packaging,
applications, photonics, f lexible Bond Interconnections for Chip-to-Wafer followed by a special session on the
and printed electronics. Interactive
presentation sessions will showcase
papers in a format that encourages more
in-depth discussion and interaction with
authors about their work.
The conference will address various
important topics and industry trends
including: mobile, 6G, medical wearables
and automotive applications including
autonomous driving, flexible and printed
electronics, high-speed communications,
wireless, photonics, high-performance
and quant u m computing, and A I
hardware. The technical presentations
and panel discussions will feature a
wide range of packaging technologies
including: hybrid bonding, wafer-level
and fan-out packaging, 2.5D, 3D and
heterogeneous integration, interposers,
chiplets, advanced substrates, assembly,
materials and ther mal modeling,
rel iabi l it y, pa ck ag i ng for ha r sh
conditions, packaging for quantum
and AI applications, interconnections,
packaging for high-speed and high-
bandwidth applications, photonics, and
flexible and printed electronics. More
than 350 authors from over twenty-
five countries have submitted to present
their work at the 73rd ECTC, covering E-Tec Interconnect AG, Mr. Pablo Rodriguez, Lengnau Switzerland
ongoing technology developments within Phone : +41 32 654 15 50, E-mail: p.rodriguez@e-tec.com
established disciplines or emerging topics
of interest for our industry.

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