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exiting radii at this transition. A loading
        is applied at a distance of 22mm from
        the end of the module lid for all cases for
        this strength requirement. We also did
        account for the pre-bent free fibers inside
        of the module and the model uses a
        nonlinear large displacement analysis to
        take into account the effects of geometry
        changes during load application.
          The configuration giving the smallest
        stress level is the tapered boot with a   Figure 15: Example of loading conditions considered on the pigtail exiting the module. The tapered boot
        softer material, which reduced the stress   design that was included in this study is shown.
        by 17%. Also, the material variation
        had more impact on reducing the stress
        than the shape and therefore plays
        an important role when the fibers are
        deflected to the side. The pigtail retention
        between the side pull and the axial
        pull are totally different—Figure 16
        represents the comparison between the
        stresses calculated for a tapered oval boot
        configuration with the softer material.
        The  stresses  are  normalized  to  the
        maximum of the axial pull load case, and
        a side pull load case that is 5.8x higher is
        observed, indicating that this condition is
        likely to be critical for the robustness of
        the module. This result is consistent with
        the experimental strength measurement
        of the fiber in the V-groove experiments
        where axial cases are significantly
        stronger than shear cases.

        Summary
          Fiber optics integration in the first-
        level  package  is  required  to  enable
        high-bandwidth  demands  for  data
        com mu nication.  T he  work  in  [1]
        studied the best anchoring location of
        a strain relief for fiber optics ribbon
        in order to protect the photonic die
        V-groove’s interconnect. The fiber
        layout within the package between
        the strain relief and the photonic die
        uses  fiber  bending  to  compensate
        for thermal and mechanical strain of
        the package. An optimization of the
        parameters permits the maintenance
        and control of the fiber bends, thereby
        alleviating the stress within the co-
        package photonic device.                                                                   RoHS
          Our  model  has  shown  that  longer                                                    P
        lengths induce less stress and are easier
        to facilitate bending. Also, with fiber
        lengths below 8mm, the required bends
        needed for strain relief would be past
        the acceptable threshold limits for the
        fiber and would create excessive stress
        in the fiber. Also, the misalignment
        in the fibers caused by the exit angle


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