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Volume 26, Number 6
November • December 2022
The Future of Semiconductor Packaging
FEATURE ARTICLES

STAFF
Kim Newman 26 Device validation: the ultimate test frontier
Publisher By Dave Armstrong
knewman@chipscalereview.com [Advantest America, Inc.]
Lawrence Michaels
Managing Director/Editor 34 Large-panel fan-out perspective on cost, yield, and capability
lmichaels@chipscalereview.com
By Clifford Sandstrom, Robin Davis, Benedict San Jose
Debra Vogler [Deca Technologies, Inc.]
Senior Technical Editor
41 Powering chips from the backside
dvogler@chipscalereview.com
By Naoto Horiguchi, Eric Beyne
[imec]
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