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November  •  December 2022         CONTENTS
        Volume 26, Number 6


                                              DEPARTMENTS

                                                EXECUTIVE VIEWPOINT
                                                   6  Cooperation is key to success of the CHIPS and
                                                      Science Act
                                                      By Asif R. Chowdhury  [UTAC Group]



         The cover article describes a double-    FEATURE ARTICLES
         sided probing system for 150µm-pitch co-
         packaged optics (CPO). Such probing
         systems address the growing need for    11   Double-sided probing system for 150μm pitch
         assured yield, particularly as heterogeneous   co-packaged optics
         integration is combined with silicon         By Collins Sun  [WinWay Technology]
         photonics needed for higher performance
         Ethernet applications to 800G.
                                                 19   High-performance computing applications drive
                                                      reliability of high-density fan-out packaging
         Cover image courtesy of iStock/
         PhonlamaiPhoto                               By Laurene Yip, Rosa Lin, Charles Lai, Cooper Peng  [MediaTek Inc.]


















































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