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September  •  October 2022           CONTENTS

      Volume 26, Number 5

                                              FEATURE ARTICLES


                                                 6 Direct bonding: a key enabler for 3D technologies
                                                    By Emilie Bourjot, Frank Fournel
                                                    [CEA-Leti]



                                               15 High-precision die attach: a major pillar
      Challenges of direct hybrid bonding           of advanced packaging
      D2W remain in performance, yield              By Percy Lam
      and cost, which are driven by
      alignment capability, bonding                 [ASMPT Limited]
      quality and throughput, respectively.
      Cover image copyright CEA-Leti, P. Jayet
                                               24 Double-sided SiP for 5G and wearable applications
                                                    By David Wang, Mike Tsai, J. Y. Chen, YP Wang
                                                    [Siliconware Precision Industries Co., Ltd]
      STAFF
      Kim Newman
      Publisher
      knewman@chipscalereview.com
                                               32 Meeting cost and technology requirements
      Lawrence Michaels                             using MLF/QFN
      Managing Director/Editor
      lmichaels@chipscalereview.com                 By Marc Mangrum
                                                    [Amkor Technology, Inc.]
      Debra Vogler
      Senior Technical Editor
      dvogler@chipscalereview.com
                                               38 Addressing temperature accuracy and uniformity
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