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May  •  June 2022                  CONTENTS
        Volume 26, Number 3


                                              DEPARTMENTS
                                                    TECHNOLOGY TRENDS
                                                 6  Scalable silicon photonics packaging using
                                                    optical bump nanoimprint lithography
                                                    By Hesham Taha
                                                    [Teramount Ltd]
                                                    Martin Eibelhuber
                                                    [EV Group]

         Extending chiplet integration to 3D   49   Pressure clip sintering for high-power electronics
         enables the placement of dies on top of    By Eric Kuah
         each other, thereby providing added        [ASM Pacific Technology Ltd]
         capacity without the added lateral
         distance. This keeps the latency low, and
         the dynamic power low. By freeing up
         valuable space inside the package, you can     FEATURE ARTICLES
         also fit more cores, and more transistors
         within a given package size.          11   The next frontier: Enabling Moore’s Law using

         Cover image courtesy of AMD                heterogeneous integration
                                                    By Raja Swaminathan
                                                    [AMD]

















































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