Page 58 - Chip Scale Review_January February_2022-digital

350+ TECHNICAL PAPERS HIGHLIGHTS
COVERING: n 41 technical sessions with a
Fan-Out WLP & CSP total number of 350+ technical
papers including:
3D & TSV Processing • 5 topical sessions including
Heterogeneous Integration one student session hosted
by the IP Subcommittee
Don’t Miss Out on the Fine Pitch Flip-Chip n 7 special invited sessions
Industry’s Premier Event! MEMS & Sensors n 50+ live Q&A sessions
Advanced Substrates
The only event that encompasses Advanced Wire Bonding n 14 CEU-approved Professional
Development Courses
the diverse world of integrated Flexible & Wearable Devices n Multiple opportunities for
networking
systems packaging. RF Components n Technology Corner Exhibits,
Automotive Electronics showcasing industry-leading
For more information, visit: Harsh Environment product and service companies
www.ectc.net Bio/Medical Devices n Various sponsorship
from around the world
Thermal/Mech Simulation opportunities for your
Conference Sponsors: Official Media Sponsor: company’s visibility
Interconnect Reliability n Great and professional digital
Optical Interconnects platform solution

ADVERTISER INDEX

Amkor Technology www.amkor.com ....................................... 1 Johnstech International www.johnstech.com/future .............. IBC

Brewer Science www.brewerscience.com ............................... 47 Leeno Industrial www.leeno.com ................................... IFC, 32
CyberOptics www.cyberoptics.com ........................................ 29 Plasma Etch www.plasmaetch.com ................................................. 54

DL Technology www.dltechnology.com .................................... 10 Sonix www.sonix.com ............................................................ 44
E-tec Interconnect www.e-tec.com ...................................... 48 SÜSS MicroTec www.suss.com ............................................. 7

ECTC www.ectc.net .................................................................. 56 Technic www.technic.com ......................................................... 18
EV Group www.evgroup.com ................................................. 2 Test Tooling Solutions Group www.tts-grp.com .............. 14, 15

IMAPS Device Packaging www.devicepackaging.org ................. 53 TSE Co. Ltd www.tse21.com ................................................. 4,5

INTEKPLUS CO., LTD. www.intekplus.com .................................. 23 Universal Instruments www.uic.com ...................................... OBC
Ironwood Electronics www.ironwoodelectronics.com ............. 42 WinWay Technology www.winwayglobal.com ......................... 27

ISC CO., LTD. www.isc21.kr ........................................................... 36 Yield Engineering Systems www.yieldengineering.com ....... 35
ITW EAE www.itweae.com ................................................ 13

March April 2022 • Space Close March 1st • Ad Materials Close March 4th • For Advertising Inquiries • ads@chipscalereview.com

56 Chip Scale Review January • February • 2022 [ChipScaleReview.com]
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