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July •  August 2023                CONTENTS
        Volume 27, Number 4

                                              DEPARTMENTS
                                                EXECUTIVE VIEWPOINT
                                                   7  A new generation of e-beam lithography to enable
                                                      packaging at the leading edge
                                                      By David K. Lam, Ken MacWilliams [Multibeam Corporation]

                                                GUEST EDITORIAL
                                                 34   Foundry 2.0: A renaissance in innovation
                                                      By Bob Patti  [NHanced Semiconductors]
         Advanced packaging technologies fuel
         today’s most exciting new applications, but   PERSPECTIVES IN R&D
         are limited in I/O density, bandwidth, and   A pioneering and successful academic-industry model in
         scale. Novel trends toward adaptable direct-  38
         write lithography are emerging to enable a   integrated systems packaging at Georgia Tech
         new generation of leading-edge advanced      By Rao R. Tummala  [Georgia Tech]
         packaging, yielding more connectivity, higher
         density, and faster speeds between chips.  INDUSTRY NEWS
         Cover image courtesy of Multibeam       45   CHIPS Act, Si-photonics among topics featured at
         Corporation                                  2023 IEEE 73rd ECTC
                                                      By Ibrahim Guven
                                                      [General Chair, 2023 IEEE 73rd Electronic Components and Technology Conference
                                                      and Virginia Commonwealth University]




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