KIM NEWMAN

Publisher

knewman@chipscalereview.com

a 15 year veteran at CSR, she joined the magazine’s sales and marketing team in 1999. Kim assumed the Publisher role in 2007 and manages the public relations strategy and execution of programs for semiconductor packaging sector industry firms. Her overall responsibilities includes publication of all CSR generated media, oversight of technical content generation for contributed editorial and development of client and agency projects including marketing collateral in support of shows and industry events and are evidenced by the success of the International Wafer-level Packaging Conference (IWLPC) with additional acknowledgements by the leading trade venues. She is synonymous with the packaging industry. Her previous positions include sales operations management at Memorex Corporation. Kim graduated with a BS from the University of California at Davis.


LAWRENCE MICHAELS

Managing Director

lxm@chipscalereview.com

became associated with CSR initially as a business and operations advisor in 2008 and joined fulltime in 2012. He brings with him a 20+ years of experience in senior systems engineering and a technical program management background from the Enterprise Business System and software industry. Additionally, he has held significant manufacturing and management positions in the avionics & aerospace industry. Lawrence holds a BS from University of Colorado and an MBA from California Lutheran University.


DEBRA VOGLER

Sr. Technical Editor

dvogler@chipscalereview.com

joined the CSR team in 2012. She is responsible for technical content selection, author coordination, editing and editorial Advisory Board representation. Having served as the Sr. Technical Editor for Solid State Technology in excess of 10 years, Debra is well-known in the advanced packaging community as a technical editor and industry media commentator covering symposiums and conferences. Debra holds BS and MS degrees in physics from Marquette University.