Industry News

August 2017

Emmanuel Sabonnadiere named LETI CEO

GRENOBLE, France – Nov. 28, 2017 – Leti, a technology research institute of CEA Tech, today announced that Emmanuel Sabonnadiere has been named CEO, succeeding Marie-Noelle Semeria.
Sabonnadiere, who has more than 25 years of executive leadership experience in a variety of large technology environments, joins Leti from CEA Tech, where he led the industrial-partnership program. He brings a strong background in new-technology development with broad private-sector expertise in operational excellence, team building and guiding multicultural organizations in business transformation in Europe and globally. ...>>

Heterogeneous integration paving the way beyond silicon scaling limits

As in prior years, the in-depth presentations at this year's IWLPC, covering a broad array of the industry's critical challenges, did not disappoint. A series of keynote presentations and papers included a couple of major announcements that will be discussed below. Of special note, several keynote speakers focused on heterogeneous integration and the added complexities of migration to large rectangular panels. The session presentations reported impressive progress in material science, manufacturing processes, new equipment, metrology, and testing. A few selected highlights, only limited by the allotted space, are included below. ...>>

MRSI Systems Launches High Speed Die Bonder for Photonics High Volume Manufacturing

North Billerica, MA, USA, August 14, 2017 - MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed Die Bonder, MRSI-HVM3, to support our photonics customers’ high volume manufacturing requirements. The MRSI-HVM3 is in full production and we are shipping to customers worldwide. ...>>

Nanusens solves the problem of stiction in MEMS inertial sensors by going smaller and creating nano-sensors in standard CMOS

Barcelona, Spain - August 3, 2017 - Nanusens has announced that its CMOS nano-sensor technology has been successfully used to solve the problem of stiction in MEMS inertial sensors, which is a major source of failure for this type of sensor.
"Our first silicon nano-sensor samples from GLOBALFOUNDRIES exceeded our expectations showing outstanding resilience to stiction, with the devices going through more than 10,000 switching cycles, each equivalent to more than 1000G shocks," explained Nanusens' CEO, Dr Josep Montanyà i Silvestre. "And the sensitivity is an order of magnitude above what is needed for a motion sensor in most applications." ...>>


St. Florian, Austria, August 2, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is celebrating the 20th anniversary of its wholly owned subsidiary in Japan, EV Group Japan KK.Established in August 1997 in Yokohama, EV Group Japan has since expanded its presence to include offices in Fukuoka and a state-of-the-art applications lab in Yokohama for process and product demonstrations, as well as increased the number of employees in the country by nearly three-fold. ...>>

Woodside Capital Partners and Yole Développement announce a joint venture agreement to expand their market research expertise

LYON, France – August 1, 2017: Woodside Capital Partners International LLC, a global, independent investment bank and Yole Développement SA (Yole) announce a joint venture. Yole will serve as a research partner for Woodside Capital’s M&A advisory practice, which provides strategic and financial advice to emerging growth companies in the technology sector. ...>>

TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends

Austin, TX - July 19, 2017 - Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these products include electronic compasses, motion sensors, barometers, microphones, and fingerprint sensors. Package types include land grid arrays (LGAs,), leadframe packages such QFNs, and wafer level packages (WLPs.). Apple is expected to account for 28 percent of the total smartphone sensor market as a result of increased sensor adoption. With the trend toward smart factories, industrial applications are also expected to account for increased sensor demand. ...>>

Toshiba Memory Corporation Develops World's First 3D Flash Memory with TSV Technology

July 11, 2017 - Tokyo, Japan --(BUSINESS WIRE)--Toshiba Memory Corporation, the world leader in memory solutions, today announced development of the world’s first[1] BiCS FLASH™ three-dimensional (3D) flash memory[2] utilizing Through Silicon Via (TSV)[3] technology with 3-bit-per-cell (triple-level cell, TLC) technology. Shipments of prototypes for development purposes started in June, and product samples are scheduled for release in the second half of 2017. The prototype of this groundbreaking device will be showcased at the 2017 Flash Memory Summit in Santa Clara, California, United States, from August 7-10. ...>>

April 2017

Management Changes - Annette Burczyk and Dr. Thorsten Teutsch assume new management duties for the PacTech Group

NAUEN, Germany - As the Group has announced, Annette Burczyk and Dr. Thorsten Teutsch took over the executive management of the PacTech Group on April 1st, 2017. Heinrich Lüdeke, who held the CEO position from 2013, stepped down at the end of March and will return to his former employer NAGASE (Europa) GmbH, Dusseldorf.
“I would like to thank Heinrich Lüdeke for the commitment and good achievements he has brought to the PacTech Group,” said Mr. Takahiro Okumura, Executive Officer of the parent company NAGASE (Japan). ...>>

March 2017

Tessera Holding Corporation announced name change to Xperi Corporation

Tessera Holding Corporation (Nasdaq: TSRA) announced that it changed its name to Xperi Corporation ("Xperi") and its Nasdaq ticker symbol to XPER, effective February 23. The change also included a new corporate logo and brand platform to reflect the company's expanded capabilities, continued technological innovation and refined vision. Xperi and its wholly owned subsidiaries, DTS, FotoNation, Invensas and Tessera, will continue to create and deliver audio and broadcast solutions, computational imaging technology, semiconductor packaging, and intellectual property licensing. ...>>

Smiths Interconnect launches brand transition to simplify customer access to technologies

Smiths Interconnect, a division of Smiths Group plc, recently announced it is unifying its technology brands of EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and TRAK under the single brand identity of “Smiths Interconnect.” ...>>

GE Ventures and Samsung Electro-Mechanics (SEMCO) recently announced a multi-year, worldwide patent license agreement

With this partnership, SEMCO will license GE’s microelectronics packaging patent portfolio, covering the fabrication of substrates embedded with electronic circuits. ...>>

Amkor Technology to acquire NANIUM S.A.

Amkor Technology, Inc. (Nasdaq: AMKR) and NANIUM S.A. have announced that they have entered into a definitive agreement for Amkor to acquire NANIUM. Terms of the transaction were not disclosed at the time of the announcement. ...>>

InvenSense and GLOBALFOUNDRIES collaborate on ultrasonic fingerprint imaging technology

InvenSense, Inc. (NYSE: INVN) and GLOBALFOUNDRIES have announced their collaboration on an ultrasonic fingerprint imaging technology for InvenSense UltraPrint Ultrasound Fingerprint Touch Sensor Solution. InvenSense and GF are enabling, for the first time, commercial manufacturing of aluminum nitride-based piezoelectric Micromachined Ultrasonic Transducers (pMUT). As a result of the close technological collaboration between InvenSense and GF, InvenSense’s CMOS-MEMS Platform can now be extended to pMUT devices and enable a biometric authentication solution for mobile and IoT products. ...>>

Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding

At the 2017 European 3D Summit in Grenoble (France, Jan 23-25), imec and EV Group (EVG) announced an extension to their collaboration, achieving excellent wafer-to-wafer overlay accuracy results in both hybrid bonding and dielectric bonding. Expanding this collaboration, EVG will become a partner in imec’s 3D integration program through a joint development agreement to further improve overlay accuracy in wafer-to-wafer bonding. ...>>

CORWIL Technology invests in portable clean environment for wafer sort

To satisfy demand for ultra-clean environments for wafer sort, CORWIL Technology (CORWIL) has added a Portable Clean Environment for wafer sort that is good to Class 1000. This is a one-stop solution from wafer sort, die prep, assembly, package test and reliability that provides the ability to understand how different pieces of the backend process affect each other in terms of yield. ...>>

Honeywell technology: keeping smartphones cool

Honeywell (NYSE: HON) has announced the availability of a thermal interface materials (TIM) solution to help smartphone manufacturers and designers effectively manage heat dissipation in their phones. Honeywell pointed out that the worldwide smartphone market is expected to reach more than 1.9 billion units by 2020, according to a study from IDC Research. In addition, data needs are growing at unprecedented rates. To meet this challenge, the smartphone industry is leveraging technology that enables phones to provide optimal processing performance without overheating. ...>>