Industry News

November 2016


Reflections on IWLPC

By Louis Burgyan [LTEC Corporation]

San Jose, CA – November 8, 2016 – The 13 th International Wafer-Level PackagingConference (IWLPC) and Exhibition,held in Silicon Valley on October 18-20, offered an excellent insight into current issues and future challenges in advanced packaging technologies.An impressive array of 48 presentations, five interactive presentations (poster sessions), and four workshops covered a wide array of topics with focus on various aspects of fan-out wafer-level packaging (FOWLP) ...>>


August 2016


Advanced Packaging Conference

Belle étoile, Alpexpo, Grenoble, France - October 25–26, 2016 - Advanced packaging technology development has always been driven by the consumer market, namely by mobile and wireless communication applications, always targeting to find solutions for those key critical aspects of packaging: Performance, Form-Factor and Cost. ...>>


July 2016


A*STAR’S IME LAUNCHES CHIP-ON-WAFER CONSORTIUM II AND COST- EFFECTIVE INTERPOSER CONSORTIUM

A*STAR’S IME LAUNCHES CHIP-ON-WAFER CONSORTIUM II AND COST- EFFECTIVE INTERPOSER CONSORTIUM TO ADVANCE CHIP PACKAGING SOLUTIONS FOR HIGH-VOLUME MANUFACTURING ...>>


June 2016


DISCO Corporation signed a global distribution agreement with Plasma-Therm

Tokyo, Japan and St. Petersburg, FL - May 31, 2016 — DISCO Corporation, the world's largest dicing equipment provider, has signed a global distribution agreement with Plasma-Therm for its plasma dicing technology, the companies announced on May 31, 2016 ...>>


May 2016


IEEE Components, Packaging and Manufacturing Technology Society Honors 2016 Award Winners

Piscataway, NJ – May 24, 2016 – The IEEE Components, Packaging and Manufacturing Technology Society (CPMT) will recognize its 2016 award winners at the 66th Electronic Components ...>>

10 BEST semiconductor equipment supplier rankings for 2016

San Jose, CA - May 18, 2016 - VLSI announces 10 BEST semiconductor equipment supplier rankings for 2016. 19 of the 20 10 BEST suppliers have achieved greater than an 8.0 rating this year. ...>>

Feburary 2016


SEMI Launches new Integrated Packaging Assembly and Test Group

Grenoble, France ─ February 9, 2016 ─ SEMI announced today the launch of the European Semiconductor integrated Packaging and Test (ESiPAT) Special Interest Group. The Special Interest Group (SIG) represents SEMI members who have semiconductor packaging, assembly, test manufacturing, or design activities in Europe. ...>>

Koh Young Announces Sale of 1000th 3D AOI System

Seoul, South Korea – February 6, 2016 - Koh Young Technology announces the delivery of their 1000th 3D in-line Inspection AOI system, a Zenith model; the system was sold to Mando-Hella Electronics Corp. (MHE), located in Songdo, Incheon, South Korea. Mando-Hella is recognized as leading the trend in advanced electronic technology in the Korean automotive market. ...>>

Smiths Connectors Announces Strategic Partnership with Phoenix Test Arrays

Kansas City, KS - February 1, 2016 - Smiths Connectors is delighted to announce a strategic partnership with Tempe, Arizona-based Phoenix Test Arrays. The collaboration between the two companies will deliver Silmat® Elastomeric Test Sockets to the global semiconductor test industry. ...>>

January 2016


SET, Smart Equipment Technology, Leading Semiconductor Supplier, Joins IRT Nanoelec 3D Integration Program

SAINT-JEOIRE, France – January 15, 2016 – SET, Smart Equipment Technology, the leading supplier in high accuracy die-to-die and die-to-wafer bonders, today announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. ...>>

NANIUM’s latest WL3D solution reduces space required by 5X

Vila do Conde, Porto, Portugal – January 14th, 2016 – NANIUM S. A., acknowledged for its experience in designing and developing innovative semiconductor packaging solutions, today announced it has developed a 3D Wafer-Level System-in-Package (WLSiP/WL3D) solution that integrates more than 40 different components. ...>>

International Wafer-Level Packaging Conference (IWLPC) General Chair Announced

Minneapolis, MN – SMTA and Chip Scale Review magazine are pleased to announce Curtis Zwenger, Amkor Technology, as the new General Chair for the 13th Annual International Wafer-Level Packaging Conference held October 18-20, 2016 in San Jose, CA. ...>>