Awarded during the 65th Electronic Components and Technology Conference
Piscataway, N.J. (May 28, 2015) – The IEEE Components, Packaging and Manufacturing Technology Society (CPMT) recognized its 2015 award winners at the 65th Electronic Components and Technology Conference (ECTC), 28 May 2015, San Diego, California, USA. With these awards, the Society honors distinguished performance in technical fields and dedication to the Society and profession.
Nasser Bozorg-Grayeli (Vice President, Technology and Manufacturing and Director, Corporate Quality Network, Intel Corporation, USA) -- 2015 IEEE Components, Packaging and Manufacturing Technology Award – "For contributions to the advancement of microelectronic packaging technology, manufacturing, and semiconductor ecosystems." One of the most influential people in the electronics board and substrate industry, Nasser Bozorg-Grayeli’s contributions have been integral to driving down component package size while incorporating more features and functionalities, enabling thinner and lighter devices. Among his many accomplishments, Dr. Bozorg-Grayeli developed Intel's first 6-inch wafer gold bumping and advance tape automated bonding packaging and manufacturing technology, which was an order of magnitude thinner than existing microprocessor packages. He led the industry’s transition of high-density packaging from ceramics to organics to reduce cost and continuously improve performance of products. He also was a champion of removing hazardous materials from packaging materials, making Intel the first company to eliminate lead in all its products.
Steve Bezuk (Qualcomm, USA) – 2015 IEEE CPMT Electronics Manufacturing Technology Award – for pioneering development, manufacturing and implementation work in mobile device packaging in the areas of interconnect technology, package structures, and package and substrate materials development and reliability.
GQ (Kouchi ) Zhang (Delft University of Technology, The Netherlands) – 2015 IEEE CPMT Outstanding Sustained Technical Contribution Award – for 20 years of technical leadership in technology strategy development and scientific excellence in heterogeneous micro/nano-electronics packaging, system integration and reliability.
Xiaowu Zhang (Institute of Microelectroncs, A*STAR, Singapore) – 2015 IEEE CPMT Exceptional Technical Achievement Award – for major contributions in the area of 2.5D/3D ICs integration, focusing primarily on process development and reliability, and stress sensor technology.
Shen-Li Fu (I-Shou University, Taiwan) – 2015 IEEE CPMT David Feldman Outstanding Contribution Award – for outstanding, sustained contributions to CPMT through leadership of the CPMT Taipei Chapter, operation of multiple international conferences and promotion of strategic professional and educational collaborations.
Liangliang Li (Tsinghua University, China) – 2015 IEEE CPMT Outstanding Young Engineer Award – for outstanding technical contributions to thermal interface materials and lead-free soldering materials through novel material synthesis and technology development, as well as service to the CPMT Society as organizer and Advisor of the CPMT Tsinghua University – Qing Hua Student Branch Chapter.
Chi Chuen (Jeffery) Lo (Hong Kong University of Science and Technology, Hong Kong) – 2015 IEEE CPMT Outstanding Young Engineer Award – for outstanding technical achievements in LED packaging development and component reliability assessment, and leadership within the CPMT Hong Kong Chapter.
Paul Svasta (POLITEHNICA University of Bucharest, Romania) – 2015 IEEE CPMT Regional Contributions Award – Region 8 (Europe, Africa, Middle East) – for sustained contributions to electronic packaging technology and education and to IEEE CPMT activities in Region 8, through leadership in the CPMT Joint Hungary and Romania Chapter, and for establishing the IEEE SIITMEC conference and student TIE competition.
Arun Chandrasekhar (Intel India, India) – 2015 IEEE CPMT Regional Contributions Award – Region 10 (Asia, Pacific) – for significant contributions to CPMT activities in Region 10, through establishing and leading the CPMT Bangalore Chapter, while simultaneously organizing and chairing IEEE EDAPS 2014.
IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacture. For more information, visit http://cpmt.ieee.org/.