2020 Issues

March • April; Volume 24, Number 2

Implementing 5G technology requires transmission of large amounts of data, reliable connections, quicker response time, and better coverage. Fully integrated RF front-end modules using a system in package (SiP) that includes antenna in package (AiP) technology, double-sided assembly, advanced wafer-level redistribution layer (RDL), passive component integration, and sophisticated RF shielding techniques provide the most advanced 5G package.


Image courtesy of Amkor

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January • February; Volume 24, Number 1

Wafer geometry is vital for process control at the front end of line, and ultimately, device yield. Additionally, as wafer thinning becomes ever more critical at the far back end of line, so too, is being able to quickly measure wafer geometry (e.g., nanotopography, roughness) on the entire wafer. Not only has wavefront phase imaging been shown to be a good candidate for FEOL and FBEOL applications, it is also showing promise for global wafer geometry measurements on patterned wafers during BEOL processes.


Photo courtesy of iStock/Norman Cooper

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