2019 Issues

March • April 2019; Volume 23, Number 2

Whether it’s 5G applications, bioimplantable electronics, the growing demand for power devices, or other challenges, the semiconductor packaging industry, powered by human brainpower, has always risen to the occasion. Looking ahead, we may be looking at artificial intelligence to help power the future of packaging design, manufacturing, and test. Enjoy the issue!



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January • February 2019; Volume 23, Number 1

The emergence of next-generation 5G, WiFi protocols, and automotive radar have pushed ICs into extreme frequency bands. High-volume 6GHz production test cells are being modified to up-convert, mix, down-convert, source, and measure for both cmWave (3GHz to 30GHz) and mmWave (30GHz to >100GHz) frequencies. Test interface hardware has now become a key differentiator for bringing these next-generation applications to market, with relatively few solutions available.


Cover image courtesy of Cohu


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