Advanced packaging techniques like FOWLP demand mature lithography solutions for the challenging processes required to manufacture high-performance devices. The Veeco-Ultratech AP300®, which was used for the research in the featured article, has a variable numerical aperture lens that can be optimized to maximize depth of focus while maintaining higher resolution performance. It can process wafers with up to 7mm of warpage and is configurable with an optical system that provides a full wafer topography map to help optimize the focus position for each exposure.
Cover photo courtesy of Veeco Instruments Inc.
The photo is a graphical representation of an intermediate step in the RDL-first fan-out process whereby the dies are placed on top of the redistribution layer (RDL) architecture before overmolding. Prior steps in the process include application of a release layer to the carrier, followed by addition of redistribution layers on top of the release layer. The RDL-first fan-out process offers distinctive advantages in terms of reduced known good die (KGD) loss, improved line/space density, etc.
Cover photo courtesy of Brewer Science Inc.
A 300mm wafer and a 510 x 515mm panel are about to be electroplated for packaging. Electroplating at the panel scale is no longer a barrier for form factor adoption in packaging. Tokyo Electron has partnered with customers to develop cutting-edge processing equipment, such as the StratusTM P300 and P500 that can process the substrates shown to create fine packaging features at superior uniformities.
Cover photo courtesy of Tokyo Electron.