The photo shows MEMS devices undergoing an automated non-destructive wire pull test on a Nordson Dage bond tester. The addition of high-resolution camera systems has enabled the development of high-performance automated bond test systems. Automation gives significant improvements in repeatability and precision and limits the influence and variation caused by the operator. Camera-assist automation capability is vital in many bond test applications including wafer-level bond and die shear, copper pillar/flipchip micro bumps, ultra-fine pitch interconnect, wire pull and shear/pull of hybrid devices.
The demanding and harsh environment in which automotive electronics must operate poses reliability challenges as the industry migrates from gold to copper bond wires. Only optimized package design with well- controlled assembly processes are suitable for this application. Potential solutions for automotive grade electronic components are presented in this article.
As present-day technologies and legislative demands evolve, so does the versatility of soldering materials and processes. Indium Corporation’s Dr. Ning-Cheng Lee, VP of Technology, and Dr. Andy C. Mackie, Senior Product Manager, review images of a copper pillar/microbump formed using one of the company’s bump-fusion fluxes. These fluxes transform rough, oxidized, plated microbumps into shiny, low-oxide, coplanar hemispheres
Open-Silicon, Inc.'s demo board showcases the benefits of 2.5D SiP technology with two SoCs powered by ARM Cortex™-A9 processors. The SoCs were manufactured on GLOBALFOUNDRIES’ 28nm-SLP (Super Low Power) process technology. Amkor Technology, Inc. assembled the logic chips across a 65nm silicon interposer. The design enables high- bandwidth communication and demonstrates several advantages of 2.5D packaging.
Advanced PoP technology configurations such as Bare Die and Molded-Laser Package each offer advantages for the smartphone and tablet markets
Experimental test set-up for pre-bond probing of 25μm-diameter 40/50μm-pitch micro-bumps for Wide-I/O three-dimensional stacked ICs. Shown is a MEMS-type vertical probe core on a probe card in an advanced engineering probe station. Underneath the probe card adapter is a 300mm test wafer.