2014 Issues

November • December 2014; Volume 18, Number 6

The photo shows MEMS devices undergoing an automated non-destructive wire pull test on a Nordson Dage bond tester. The addition of high-resolution camera systems has enabled the development of high-performance automated bond test systems. Automation gives significant improvements in repeatability and precision and limits the influence and variation caused by the operator. Camera-assist automation capability is vital in many bond test applications including wafer-level bond and die shear, copper pillar/flipchip micro bumps, ultra-fine pitch interconnect, wire pull and shear/pull of hybrid devices.

Photo courtesy of Nordson DAGE

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September • October 2014; Volume 18, Number 5

The demanding and harsh environment in which automotive electronics must operate poses reliability challenges as the industry migrates from gold to copper bond wires. Only optimized package design with well- controlled assembly processes are suitable for this application. Potential solutions for automotive grade electronic components are presented in this article.

Cover image courtesy: Shutterstock

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July • August 2014; Volume 18, Number 4

As present-day technologies and legislative demands evolve, so does the versatility of soldering materials and processes. Indium Corporation’s Dr. Ning-Cheng Lee, VP of Technology, and Dr. Andy C. Mackie, Senior Product Manager, review images of a copper pillar/microbump formed using one of the company’s bump-fusion fluxes. These fluxes transform rough, oxidized, plated microbumps into shiny, low-oxide, coplanar hemispheres

Cover image courtesy of Indium Corporation

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May • June 2014; Volume 18, Number 3

Open-Silicon, Inc.'s demo board showcases the benefits of 2.5D SiP technology with two SoCs powered by ARM Cortex™-A9 processors. The SoCs were manufactured on GLOBALFOUNDRIES’ 28nm-SLP (Super Low Power) process technology. Amkor Technology, Inc. assembled the logic chips across a 65nm silicon interposer. The design enables high- bandwidth communication and demonstrates several advantages of 2.5D packaging.

Photo courtesy of Open-Silicon, Inc.

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March • April 2014; Volume 18, Number 2

Advanced PoP technology configurations such as Bare Die and Molded-Laser Package each offer advantages for the smartphone and tablet markets

Photo: Courtesy of STATS ChipPAC



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January • February 2014; Volume 18, Number 1

Experimental test set-up for pre-bond probing of 25μm-diameter 40/50μm-pitch micro-bumps for Wide-I/O three-dimensional stacked ICs. Shown is a MEMS-type vertical probe core on a probe card in an advanced engineering probe station. Underneath the probe card adapter is a 300mm test wafer.

Photo: Bart De Wachter/Fred Loosen – imec, Leuven, Belgium

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