May • June 2018; Volume 22, Number 3
Advanced packaging techniques like FOWLP demand mature lithography solutions for the challenging processes required to manufacture high-performance devices. The Veeco-Ultratech AP300®, which was used for the research in the featured article, has a variable numerical aperture lens that can be optimized to maximize depth of focus while maintaining higher resolution performance. It can process wafers with up to 7mm of warpage and is configurable with an optical system that provides a full wafer topography map to help optimize the focus position for each exposure.
Cover photo courtesy of Veeco Instruments Inc.
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We help fabless IC companies miniaturize and productize their chip-level designs into MMICs, CMOS, SiGe, GaAs, InP, GaN or SiC Multiple-Chip Modules, 100-400Gbps Optoelectronic Packages or RF/Microwave Board Assemblies.
Somerset, NJ – May 9th, 2018 –
Alpha Assembly Solutions, a world leader in the production of electronic soldering and bonding materials, has recently announced their acquisition of HiTech Korea Co., LTD (HiTech), a premier electronics assembly polymer and epoxy-based materials supplier, with its primary operational facility in Korea.
Poway, CA., & Norwood, MA - May 8, 2018 -
Cohu, Inc. (NASDAQ:COHU) and Xcerra Corporation (NASDAQ:XCRA) announced they have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock. The acquisition is expected to make Cohu a global leader in semiconductor test, with combined sales for Cohu and Xcerra in excess of $800 million for the last twelve months.
St. Florian, Austria, May 2, 2018 -
EV Group (EVG) announced that it has started construction work for the next expansion phase of its corporate headquarters. The new, state-of-the-art building will house EVG's "Manufacturing III" facility, which will more than double the floor space for the final assembly of EVG's systems.
April 30, 2018 Kaohsiung City, Taiwan -
ASE Industrial Holding Co., Ltd. is jointly established by the combination of Advanced Semiconductor Engineering, Inc. and Siliconware Precision Industries Co., Ltd (SPIL). ASE Industrial Holding will enhance research and development capability, expand global market footprint, contribute advanced technical support for next-generation applications, and provide miniaturized, high-quality, highly integrated, and fast time-to-market services to all customers.
Singapore and Hong Kong, April 3rd, 2018 -
ASM Pacific Technology Ltd. (“ASMPT”) announced that it has completed its acquisition of 100% of the shares of AMICRA Microtechnologies GmbH (“Amicra”). Amicra is a leading supplier of high-precision die bonders for the photonics and advanced packaging markets. The transaction, which completed on April 4, 2018 will bring about a strengthened business, well-placed to serve not only the fast growing silicon photonics assembly equipment market, but also the wider high-precision flip-chip and die bonding markets.
Singapore and Hong Kong, April 3rd, 2018 -
ASM Pacific Technology Ltd. (ASMPT) announced that it has signed a definitive agreement with Tokyo Electron Limited (TEL) to acquire TEL NEXX, Inc. (NEXX). The deal is expected to close when approvals from the authorities have been received. The acquisition is another major step by the Group in pursuing its growth strategy of tapping into new high-growth markets and expanding their product offerings to the semiconductor advanced packaging market.
San Diego CA - June 3-6, 2018 - The 28th Annual SW Test Workshop will be held at the Rancho Bernardo Inn. The conference will begin on Sunday morning with a golf tournament and Sunday afternoon with a topical tutorial, followed by a welcome reception, dinner, and a Keynote Speaker. ...>>
San Jose, CA - June 26-28, 2018 - For 30+ years, Sensors Expo & Conference has established itself as North America's premier event focused exclusively on sensors and sensor-integrated systems. Join us in the heart of Silicon Valley at the McEnery Convention Center in San Jose, California - to be a part of the only event where you can find solutions for your present sensing technologies while exploring sensing technologies that are driving tomorrow's solutions. ...>>
San Francisco, CA – July 10-12, 2018 - Three days of presentations with more than 80+ hours of technical and business programming, plus hundreds of exhibitors provide the insights, innovations, and intelligence you need to get ahead and embrace today’s disruptive landscape. ...>>
Shanghai, China - August 8 to 11, 2018 – The 19th International Conference on Electronic Packaging Technology (ICEPT) will be held in Shanghai, China, from August 8 to 11, 2018. The ICEPT 2018 is organized by Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), and Fudan University (FDU), and co-organized by National Center for Advanced Packaging Co,.Ltd (NCAP China), and technically sponsored by IEEE Electronics Packaging Society (EPS), Electronics Manufacturing and Packaging Technology (EMPT) Society of Chinese Institute of Electronics (CIE) and China Association for Science and Technology (CAST). ICEPT is one of the flagship conferences of IEEE EPS in China. ...>>
Industry Outlook and Technology Trends in IC Packaging Market
Andrea Lati, Director of Market Research
VLSI Research ...>>