September • October 2018; Volume 22, Number 5
The ZEISS Xradia 520 Versa X-ray microscope (XRM) provides non-destructive package-level failure analysis and 3D volumetric and linear measurements on packaging structures with submicron resolution. The photo, taken inside the XRM chamber, shows a loaded sample being prepared for measurement just after placement by the robotic arm. The XRM system collects 2D projection images from the rotating sample, which is positioned between an X-ray source and detector, and then uses proprietary software to reconstruct 3D volume data that may be visualized and analyzed. Scintillator-coupled microscope objectives enable it to maintain resolution regardless of package size.
Cover image courtesy of Zeiss.
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Call for Papers
is now open for the 2019 IEEE Electronic Components and Technology Conference (ECTC 2019), to be held May 28 –May 31, 2019, at The Cosmopolitan of Las Vegas, Nevada, USA. 2019
ECTC Abstract Submission Deadline is October 8
This premier international conference, sponsored by the IEEE Electronics Packaging Society (IEEE EPS), covers a wide spectrum of electronic packaging technology topics, including components, materials, assembly, interconnect design, device and system packaging, wafer level packaging, Si photonics, LED and IoT, optoelectronics, 2.5D and 3D integration technology, and reliability.
Clinton, NY USA - July 26, 2018 -
Indium Corporation and MEL Systems and Services Ltd. (MELSS) have formed a strategic partnership to expand accessibility to Indium Corporation soldering materials throughout India. MELSS will be selling all of Indium Corporation’s soldering materials, such as low-voiding solder paste and solder preforms for bottom termination components, solder wire for hand and robotic soldering, and rework fluxes.
Tempe, AZ USA - July 18, 2018 -
Amkor Technology announced today it has partnered with Mentor to release Amkor's SmartPackage™ Package Assembly Design Kit (PADK), the first in the industry to support Mentor's High-Density Advanced Packaging (HDAP) design process and tools. Amkor's award-winning High-Density Fan Out (HDFO) process can now be used in conjunction with Mentor's software to deliver early, rapid and accurate verification results of advanced packages required for Internet-of-Things, automotive, high-speed communications, computing and artificial intelligence applications.
Somerset, NJ – May 9th, 2018 –
Alpha Assembly Solutions, a world leader in the production of electronic soldering and bonding materials, has recently announced their acquisition of HiTech Korea Co., LTD (HiTech), a premier electronics assembly polymer and epoxy-based materials supplier, with its primary operational facility in Korea.
Poway, CA., & Norwood, MA - May 8, 2018 -
Cohu, Inc. (NASDAQ:COHU) and Xcerra Corporation (NASDAQ:XCRA) announced they have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock. The acquisition is expected to make Cohu a global leader in semiconductor test, with combined sales for Cohu and Xcerra in excess of $800 million for the last twelve months.
St. Florian, Austria, May 2, 2018 -
EV Group (EVG) announced that it has started construction work for the next expansion phase of its corporate headquarters. The new, state-of-the-art building will house EVG's "Manufacturing III" facility, which will more than double the floor space for the final assembly of EVG's systems.
April 30, 2018 Kaohsiung City, Taiwan -
ASE Industrial Holding Co., Ltd. is jointly established by the combination of Advanced Semiconductor Engineering, Inc. and Siliconware Precision Industries Co., Ltd (SPIL). ASE Industrial Holding will enhance research and development capability, expand global market footprint, contribute advanced technical support for next-generation applications, and provide miniaturized, high-quality, highly integrated, and fast time-to-market services to all customers.
Singapore and Hong Kong, April 3rd, 2018 -
ASM Pacific Technology Ltd. (“ASMPT”) announced that it has completed its acquisition of 100% of the shares of AMICRA Microtechnologies GmbH (“Amicra”). Amicra is a leading supplier of high-precision die bonders for the photonics and advanced packaging markets. The transaction, which completed on April 4, 2018 will bring about a strengthened business, well-placed to serve not only the fast growing silicon photonics assembly equipment market, but also the wider high-precision flip-chip and die bonding markets.
Singapore and Hong Kong, April 3rd, 2018 -
ASM Pacific Technology Ltd. (ASMPT) announced that it has signed a definitive agreement with Tokyo Electron Limited (TEL) to acquire TEL NEXX, Inc. (NEXX). The deal is expected to close when approvals from the authorities have been received. The acquisition is another major step by the Group in pursuing its growth strategy of tapping into new high-growth markets and expanding their product offerings to the semiconductor advanced packaging market.