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November • December 2017; Volume 21, Number 6

Cover Photo

The photo shows a close-up of a FormFactor Pyramid Probe® Rocking Beam Interposer (RBI) probe core. Clearly visible is the tiplayer membrane on top of the space transformer membrane, which connects to the core-I/Os on the four edges of the probe core’s metal frame. The background photo depicts the probe core screwed into its 300mm probe card in the test system for evaluation of large-array fine-pitch micro-bump probes in Fab-2 at imec.

Photo: Fred Loosen
Photo composition: Ferenc Fodor and Erik Jan Marinissen – imec, Belgium.

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Look to Bourns’ Specialty Engineering and Manufacturing Services (SEMS) for extensive product and process development expertise in: Microelectronic MCM packaging -- State-of-the-art ceramic and plastic (LCP) lid sealing process – Advanced IC interconnects with high-precision wire bonding – Precision component placement on circuit substrates. As a highly reliable Packaging-as-a-Service (PaaS) provider, we help fabless IC companies miniaturize and productize their chip-level designs into MMICs, CMOS, SiGe, GaAs, InP, GaN or SiC Multiple-Chip Modules, 100-400Gbps Optoelectronic Packages or RF/Microwave Board Assemblies.

Industry News

Emmanuel Sabonnadiere named LETI CEO

GRENOBLE, France – Nov. 28, 2017 – Leti, a technology research institute of CEA Tech, today announced that Emmanuel Sabonnadiere has been named CEO, succeeding Marie-Noelle Semeria.
Sabonnadiere, who has more than 25 years of executive leadership experience in a variety of large technology environments, joins Leti from CEA Tech, where he led the industrial-partnership program. He brings a strong background in new-technology development with broad private-sector expertise in operational excellence, team building and guiding multicultural organizations in business transformation in Europe and globally. ...>>

Heterogeneous integration paving the way beyond silicon scaling limits

As in prior years, the in-depth presentations at this year's IWLPC, covering a broad array of the industry's critical challenges, did not disappoint. A series of keynote presentations and papers included a couple of major announcements that will be discussed below. Of special note, several keynote speakers focused on heterogeneous integration and the added complexities of migration to large rectangular panels. The session presentations reported impressive progress in material science, manufacturing processes, new equipment, metrology, and testing. A few selected highlights, only limited by the allotted space, are included below. ...>>

Industry Events

The European 3D Summit for the first time in Dresden, Germany

Dresden, Germany - January 22-24, 2018 – This year’s 6th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, thermal management and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications. ...>>