Industry Events - 2018

July 2018

International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters and Program Announced

San Jose, CA USA - July 25, 2018 - The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters and program for the 15th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 23-25, 2018 at the DoubleTree by Hilton Hotel in San Jose, California. A compelling technical program awaits in this year’s conference. The technical program has three parallel tracks with two full days of presentations on wafer-level packaging, 3D integration, and advanced manufacturing technologies. Building on last year’s success IWLPC will again feature an international stage panel discussion entitled: “Scaling-Up Panel-Level Processing: Challenges and Opportunities”. IWLPC will deliver four Professional Development Courses and an Interactive Poster Presentation Session. Three keynote talks by distinguished leaders in the industry will take center stage.

Keynote Presentations

Growth of WLSI and Wafer Foundry with Moore's Law and More-than-Moore, and Vice Versa
Tuesday, October 23, 2018 | 9:00am
Douglas C.H. Yu, Ph.D.
Vice President, Research & Development
Taiwan Semiconductor Manufacturing Company (TSMC)

Douglas C.H. Yu is a Vice President of TSMC R&D in charge of advanced interconnect and packaging technology development. He pioneered and delivered WLSI (Wafer-Level-System-Integration) technology platform, which includes 3DIC/TSV (CoWoS®), Integrated Fan Out Wafer-Level-Packaging (InFO) and advanced WL-CSP, for system integration of wide range products. Prior to that, Doug was responsible for the development and of industry’s first advanced on-chip Cu/Low-K interconnects at TSMC’s 0.13 micron technology node. He received Ph.D. degree on Materials Science and Technology from Georgia Institute of Technology. He has numerous publications and granted more than 500 US patents. Doug is an IEEE Fellow.


Monolithic versus Heterogeneous Packaging: Where Does the Future Lie?
Tuesday, October 23, 2018 | 1:45pm
Walden Rhines, Ph.D.
President and Chief Executive Officer
Mentor, a Siemens business

Cost, risk, and the limitations of monolithic scaling are driving the growth of multi-die (heterogeneous) advanced IC packaging solutions. The integration of different functions into a highly optimized, yet variant-capable device is attractive to markets such as automotive, industrial IoT, and aerospace & defense, whose applications often do not have the quantities to justify the cost of a SoC implementation. Although system-in-package (SiP) has been around for some years and is well proven, the advent of high-density advanced packaging (HDAP) designs has stimulated the development of new tools and processes that can address such verification challenges as overall device connectivity, timing, functional verification, and thermal/stress analysis.


Interconnected World and the Automotive Paradigm
Wednesday, October 24, 2018 | 9:00am
Veer Dhandapani, Ph.D.
Head of Automotive Packaging
NXP Semiconductors

Innovations in the automotive industry today are synonymous with technological advances not only in automotive domains such as electric power, braking etc. but also in mobile, home, office electronics and their applications to the automobiles we drive. Energy efficiency, the seamless connected car and advanced driver assist systems are the dominant trends driving the integration of highly innovative electronics in cars. This presentation will discuss how these technologies merge to serve the pilots of these advanced machines and the unique challenges that unifying these diverse domains provide. Meeting reliability, vehicle and functional safety as well as security requirements that the above trends dictate will be the focus of this presentation. These challenges are constantly evolving, especially as automotive electronics take advantage of the benefits of silicon scaling and incorporate leading edge nodes earlier than ever before.

Registration for IWLPC is now open online. Visit for more information.
Contact Jenny Ng at 952-920-7682 or email: with questions.

Semiconductor Industry Speaker Series

Wednesday, September 12, 2018 / 11:30am - 1:00 pm
(Registration opens and lunch starts at 11:30am / Talk starts at noon)
SEMI Global Headquarters
673 South Milpitas Blvd., Milpitas, CA 95035

Package Assembly Design Kits - The Technology Bridge between Chip Design and High-Density Fan Out Design, Manufacturing, and Assembly
Ruben Fuentes, Vice President, WW Design, Amkor Technology

Process design kits (PDKs) are well-known catalysts in integrated circuit (IC) design. However, they are somewhat of a mystery and a new concept to the packaging world. As a result, many packaging engineers do not understand why PDKs are pivotal to the success of IC designs. Traditionally, packaging companies provide only a copy of their design rules because package design rules tend to be very dynamic. This concept is where IC design and traditional package design philosophies collide. In high-density fan-out (HDFO) applications, the practice of sharing only design rules creates many unnecessary delays and back-and-forth design iterations between the package designer and the HDFO manufacturer. In contrast, package assembly design kits (PADKs) enable designers to validate their designs throughout the design process. Although package design and IC design are two different worlds, they do share several key similarities. These similarities have contributed to the successful use of package assembly design kits. Attendees can expect to leave with a broader understanding of how PADKs can significantly increase productivity, reduce cycle times and limit the number of design iterations in HDFO applications.

For additional information & registration::

MEMS and Sensors Summit
Enabling Innovation

Grenoble, France - September 19-21, 2018 - MEMS and sensors devices are applied in a diverse and growing list of products – mobile, automotive, industrial, health/medical, etc. With the top MEMS and sensors producers, RTO’s, Start-ups located in Europe, Grenoble is a fitting location to connect international experts and industry executives with each other. The event will offer numerous opportunities for attendees to network and develop their business interests. Due to the co-location with Imaging & Sensors Summit – it is the only event where industry executives can exchange directly ideas and information coming from both technology communities. Join us at MEMS & Imaging Summits!

For additional information:

Imaging and Sensors Summitt
Sensing the Future – Capturing the Future

Grenoble, France - September 19-21, 2018 -Imaging and Sensors applications are growing rapidly and the use of their devices is increasing: automotive, industrial, medical and agricultural applications drive to dramatic progress. What gained explosive growth as a smartphone feature has now evolved into an enormous spectrum of applications. The event will bring together stakeholders and c-level speakers to discuss new technologies, smart integration of different sensors for innovative applications and future market opportunities. Due to the co-location with MEMS & Sensors Summit – it is the only event where industry executives can exchange directly ideas and information coming from both technology communities. Join us!

For additional information: http://

Semiconductor Industry Speaker Series

Monday, October 22, 2018 / 11:30am - 1:00 pm
SEMI Global Headquarters
673 South Milpitas Blvd., Milpitas, CA 95035

The Road Ahead: Outlook for the Industry
E. Jan Vardaman, President
TechSearch International, Inc.

The semiconductor industry has seen record growth in the last few years, but with slowing growth in the smartphone shipments and PC sales what’s next? What will drive growth in advanced packaging? Is it Game Over for Cryptocurrency? Artificial Intelligence and automotive electronic are bright spots, but what type of package s will be used? How will OSATs benefit and what role will the foundry play? This presentation will examine economic and technology trends and provides an outlook for the industry.

For additional information & registration::