Industry Events - 2018

June 2018


Semiconductor Wafer Test Workshop

San Diego CA - June 3-6, 2018 - The 28th Annual SW Test Workshop will be held at the Rancho Bernardo Inn. The conference will begin on Sunday morning with a golf tournament and Sunday afternoon with a topical tutorial, followed by a welcome reception, dinner, and a Keynote Speaker. The Technical Program will start Monday morning with 30-minute presentations in theme-oriented sessions. SW Test EXPO 2018 will showcase many of the key suppliers to the wafer probe industry and, as always, there will be ample opportunities for networking. This year, we will also feature two poster sessions during which attendees can meet with authors face-to-face. The conference will conclude on Wednesday at Noon after an awards presentation. Conference registration includes all meals, refreshments, social activities, and technical program and exhibit attendance, as well as the eProceedings.

For additional information: www.swtest.org


SENSORS EXPO & CONFERENCE: The Premier Event for Sensors, connectivity, and systems

San Jose, CA - June 26-28, 2018 - For 30+ years, Sensors Expo & Conference has established itself as North America's premier event focused exclusively on sensors and sensor-integrated systems. Join us in the heart of Silicon Valley at the McEnery Convention Center in San Jose, California - to be a part of the only event where you can find solutions for your present sensing technologies while exploring sensing technologies that are driving tomorrow's solutions.

It's more than the industry's leading tradeshow. And this June, there's more opportunity than ever to connect with the industry and the technologies driving it. Will you be there?

This is the only technical program covering 100% sensors. The Sensors Conference is where you'll find the best in the sensors industry, along with new and innovative ways to jump start your sensor solutions. It's North America's largest and most comprehensive educational program that brings together thousands of engineering professionals all under one roof. With updated tracks, exciting and visionary Keynote Presentations, and all-new Pre-Conference Symposia, the Sensors 2018 Conference Program brings you the leading sensors content that you need to succeed from over 100 industry experts. Expanding the program to include interactive content, applications, demos, and hands-on components, the 2018 Conference will have you walking away with the sensors solutions you need.

For additional information: www.sensorsexpo.com


San Francisco, CA – July 10-12, 2018 - Three days of presentations with more than 80+ hours of technical and business programming, plus hundreds of exhibitors provide the insights, innovations, and intelligence you need to get ahead and embrace today’s disruptive landscape.

From materials, equipment, design, manufacturing, system integration, and demand channels to new verticals and adjacencies such as Flexible Hybrid Electronics, MEMS & Sensors, you’ll gain access to the best in the business and get a glimpse at what’s next. Immersive, new experiences demonstrating hot-buttons like Smart Transportation, Smart Manufacturing, MedTech, Big Data, IoT, and the cognitive technologies that are transforming the world make this year’s Expo like no other before.

SEMICON West connects the entire extended electronics supply chain — in one place, at one time. It’s the premier place to re-connect with your contacts and make new ones to drive your business forward. With all-new networking events, three new “Meet the Experts” Theaters, and new immersive Smart Pavilion experiences, this year’s Expo will help you connect with more qualified customers and partners than ever before.

For additional information: www.semiconwest.org


Electronic Packaging and Technology Conference (EPTC)
Final call for Papers – July 27, 2018

Singapore, July 27, 2018 – The Final Call for papers date for the 20th Electronics Packaging Technology Conference (EPTC 2018) has been announced. The EPTC 2018 conference is an International event organized by the IEEE RS/EPS /EDS Singapore Chapter and co-sponsored by IEEE Electronics Packaging Society (EPS). EPTC 2018 will feature keynotes, technical sessions, short courses, forums, an exhibition, social and networking activities. It aims to provide a good coverage of technology developments in all areas of electronics packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts. Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in the Asia-Pacific and is well attended by experts in all aspects of packaging technology from all over the world. EPTC is the flagship conference of IEEE EPS in Region 10.

CONFERENCE TOPICS: You are invited to submit an abstract, presenting new developments in the following categories:

  • Advanced Packaging: TSV/Wafer Level Packaging:
  • Interconnection Technologies:
  • Emerging Technologies:
  • Materials and Processing:
  • Equipment and Process Development & Automation
  • Electrical Simulation & Characterization: Mechanical Simulation & Characterization:
  • Thermal Characterization & Cooling Solutions:
  • Quality, Reliability & Failure Analysis:
  • Others are also welcomed, e.g. Market trends, Environmental, legislation, Patents, Education, Cost Analysis

IMPORTANT DATES:

  • 30th Mar 2018 - Start online abstract submission
  • 27th Jul 2018 - Closing of abstract submission (Extended)
  • 15th August 2018 - Notification of acceptance
  • 15th September 2018 - Submission of manuscript

Do not miss this opportunity to be part of EPTC 2018!

You are invited to register and submit your abstracts online by the deadline 27 July 2018 at http://www.conftool.net/eptc2018/

For more details about EPTC2018, please visit the website: www.eptc-ieee.net


San Diego CA - June 3-6, 2018 - The 28th Annual SW Test Workshop will be held at the Rancho Bernardo Inn. The conference will begin on Sunday morning with a golf tournament and Sunday afternoon with a topical tutorial, followed by a welcome reception, dinner, and a Keynote Speaker. The Technical Program will start Monday morning with 30-minute presentations in theme-oriented sessions. SW Test EXPO 2018 will showcase many of the key suppliers to the wafer probe industry and, as always, there will be ample opportunities for networking. This year, we will also feature two poster sessions during which attendees can meet with authors face-to-face. The conference will conclude on Wednesday at Noon after an awards presentation. Conference registration includes all meals, refreshments, social activities, and technical program and exhibit attendance, as well as the eProceedings.

For additional information: www.swtest.org


19th International Conference on Electronic Packaging Technology (ICEPT)

Shanghai, China - August 8 to 11, 2018 – The 19th International Conference on Electronic Packaging Technology (ICEPT) will be held in Shanghai, China, from August 8 to 11, 2018. The ICEPT 2018 is organized by Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), and Fudan University (FDU), and co-organized by National Center for Advanced Packaging Co,.Ltd (NCAP China), and technically sponsored by IEEE Electronics Packaging Society (EPS), Electronics Manufacturing and Packaging Technology (EMPT) Society of Chinese Institute of Electronics (CIE) and China Association for Science and Technology (CAST). ICEPT is one of the flagship conferences of IEEE EPS in China.

ICEPT 2018 is a four-day event, featuring technical sessions, invited talks, professional development courses, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.

For additional information: www.icept.org/en


Semiconductor Industry Speaker Series


Wednesday, June 13, 2018 / 11:30am - 1:00 pm
(Registration opens and lunch starts at 11:30am / Talk starts at noon)
SEMI Global Headquarters
673 South Milpitas Blvd., Milpitas, CA 95035

Industry Outlook and Technology Trends in IC Packaging Market
Andrea Lati, Director of Market Research
VLSI Research

Abstract to come

Andrea Lati is the Director of Market Research at VLSI Research Inc. Since joining VLSI Research in 2001, Andrea has been focusing on managing and developing forecasting models as well as performing market analysis and research on electronics, semiconductor, and equipment markets.