Industry Events - 2017

December 2017


The European 3D Summit for the first time in Dresden, Germany

Dresden, Germany - January 22-24, 2018 – This year’s 6th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, thermal management and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications.

Meet leading companies, learn about new technologies, and mingle with people driving the future of 3D Integration design and manufacturing. Conference, Exhibition and Networking: this is the European 3D Summit. Invited speakers will present strategies among the 3D Integration technologies pallet, giving particular attention to current adoption for applications.

KEYNOTES:

  • Opportunities and Challenges in 3D Stacked Components
    Bob Sankman, Director, Assembly Technology Pathfinding, Intel

  • Heterogeneous Integration: A Driving Force and Enabling Technology for 3D SiP Products
    Bill Bottoms, Chairman, 3MTS

  • NAND: Wire Bond’s Last Stronghold for 3D-Integrated Devices
    Tom Gregorich, Senior Director Package Engineering, Western Digital

  • Advanced Panel-Level Interconnect and Embedding Technologies for 3D Module Integration
    Martin Schrems, Director Strategy & Business Development, AT&S

  • Photonic packaging compatibility with high throughput manufacturing
    Richard Langlois, IBM

  • Comb & Hybrid Laser Driven WDM Silicon Photonic Interconnects for Exascale and HPC applications
    Ashkan Seyedi, Research Scientist - Large-Scale Integrated Photonics, Hewlett Packard

For more details, please visit: http://www.semi.org/eu/european-3d-summit-2018
Contact: Michael Kaiser, SEMI Europe - mkaiser@semi.org