Industry Events - 2017

April 2017

15th Annual – 2017 MEMS and Sensors Technology Symposium Leading Perspectives Across the Supply Chain

Much has changed over the last 15 years in the electronics industry, one of the most significant being the incredible growth of MEMS enabled sensors. The use of sensors in mobility applications has increased by more than 1000-fold over the last decade alone. MEPTEC’s 15th Annual MEMS and Sensors symposium is evolving as well, explicitly acknowledging sensors and how their integration in mobility, wearables, health care, automotive and healthcare devices continue to change the way we live, move, and communicate. As these rapid transitions continue, what do the industry leaders see as new applications that will continue to drive these trends? What use cases require us to develop innovative solutions to enable highly reliable and cost effective products? At what point do we need alternative and out of the box solutions to keep up with the projected demand in tens of billions of units? Will serial manufacturing and test solutions of today scale to meet these requirements or do we need new additive manufacturing solutions to keep pace?

Topics will include:

  • New applications driving sensor technologies: smart textiles, automotive sensors, VR/AR systems, DNA sequencing and diagnostics, etc.

  • Manufacturing solutions for existing and new sensor technologies: Si technology evolution driving radical performance improvements in traditional MEMS (inertial, pressure, etc.); additive manufacturing solutions for sensors; radical package and system level integration solutions including integrated batteries, etc.

Join us to hear from ODMs, OEMs and foundry/OSAT leaders to hear how we can address the applications needs and the required capabilities to keep pace with evolving MEMS and Sensor demands.

For additional information: .

Burn-in and Test Strategies (BiTS) Workshop 2017 sees attendance boost

The Burn-in and Test Strategies (BiTS) Workshop held its 18th annual North American event March 5-8 in Mesa, AZ. The event was attended by more than 240 test engineers and managers from around the world, representing more than 100 companies including top foundries, fabless, and integrated device manufacturers and outsourced subassembly and test suppliers (OSATS), as well as suppliers of equipment and consumables to the semiconductor industry. In total, more than 400 people participated in this year’s event.

  Thirty-two technical presentations were delivered by suppliers, end-users and engineering professionals. The presentations underscored the event’s theme of test fundamentals applied to leading edge applications legacy challenges. One of the event’s largest poster sessions reinforced the theme and highlighted related and contemporary topics.

  The BiTS 2017 Awards went to the following:

Category Title Author(s)
Best Presentation "Contactor Based Final Test at 77 GHz on a Multi- Channel Radar Transceiver Chipset" Brian Nakai & Jeffrey Finder – NXP Semiconductors
Best Data "High Current Final Test Contactor Development" Thiha Shwe & Hisashi Ata-Texas Instruments Kenichi Sato - Yokowo
Most Inspirational “New Possibility with Coax Via Risers” Matthew Priolo, Adrian Rodriquez, Christopher Kinney, & Adewale Oladeinde – Intel Corporation
Most Educational "Flat Probe Technology For High Frequency Test" Jason Mroczkowski & Nadia Steckler - Xcerra
Attendee Choice "Coming to terms with Burn-In sockets" James Tong - Texas Instruments
Best Poster "Low Cost / Low Profile Spring Probe" Samuel Pak - IWIN Co., Ltd.


A keynote presentation given by Thomas Sonderman of Rudolph Technologies addressed the challenges of trust and collaboration required by Industry 4.0 and was well received by attendees. In addition, BiTS 2017 featured a tutorial on interconnect sockets delivered by Ashok Kabadi of AK Technology Leadership and Mohan Prabhugoud of Intel.

  The ever-popular BiTS EXPO provided an opportunity for fifty-one companies to provide invaluable information to both attendees and visitors from the local technology community.

  The BiTS technical program and exhibition are dedicated to providing a forum for sharing the latest information on a broad range of test topics including final/packaged part test, wafer sort, and burn-in. Attendees provided very positive feedback regarding the opportunities to meet, network, and explore current test ideas and challenges with other professionals who are focused on emerging test challenges.

  Twin Solution Technology was the BiTS 2017 Premier Sponsor while Test Tooling Solutions Group continued its support as the Emeritus Sponsor.

  “The strong on-going presence of an international group of professionals visiting BiTS underscores the strength of the workshop’s program,” said Ira Feldman, General Chairman for the Burn-in and Test Strategies workshop. “This year, over 36% of participants were international visitors to Mesa, AZ. And professional and overall participation was up by greater than 20% compared to last year. We believe there will also be an even greater growth in attendance when BiTS China returns to Shanghai this September.”

  The BiTS Technical Committee comprises volunteers from across the industry and around the world. They represent companies who are interested in helping to shape the conference and the industry.