Contributing Editors

Rao Tummala, Ph.D

Contributing Editor - Advanced Packaging

Prof. Rao Tummala is a Distinguished and Endowed Chair Professor at Georgia Tech in the USA. He is well known as an industrial technologist, technology pioneer, and educator. Prior to joining Georgia Tech, he was an IBM Fellow and Director of Advanced Systems Packaging, pioneering such major technologies as the industry’s first plasma display in the 1970s and the first and next two generations of 100-chip MCM package integration in the 1980s for servers, mainframes and supercomputers. He is the father of LTCC and the system-on-package (SoP) technologies. As an educator, Prof. Tummala was instrumental in setting up the largest Academic Center funded by NSF as its 1st NSF Engineering Research Center in Electronic Systems at Georgia Tech, pioneering an integrated approach to research, education and industry collaborations with companies in the U.S., Europe, Japan, Korea, Taiwan and China. The Center, referred to as PRC, produced and supplied more than 1200 PhD and MS packaging engineers to the electronic industry. He has published about 800 technical papers and invented technologies that resulted in over 110 patents and inventions. He wrote the first modern handbook in packaging, Microelectronics Packaging Handbook (1988); then the first undergrad textbook, Fundamentals of Microsystem Packaging (2001); and the first book introducing the concept of SoP, Introduction to System-on-Package (2006). He received more than 50 industry, academic and professional society awards. He is a member of NAE and an IEEE Fellow, as well as President of the IEEE CPMT and IMAPS Societies.

John H. Lau, Ph.D

Contributing Editor - Advanced Packaging

John H. Lau has been a Senior Technical Advisor of ASM Pacific Technology in Hong Kong since 2014 and a Senior Scientist at HP Labs/Agilent in California, U.S.A., for more than 25 years. He has published more than 470 peer-reviewed papers, has 30 issued and pending US patents, and 20 textbooks on flip-chip technologies, WLCSP, FOWLP, BGA, TSV for 3D integration, advanced MEMS packaging, lead-free solder and manufacturing, and reliability of 2D and 3D IC interconnections. John earned a PhD from the U. of Illinois – Urbana and is an ASME Fellow, IEEE Fellow, and IMAPS Fellow.

Steffen Kroehnert

Contributing Editor - Advanced Packaging

Steffen Kroehnert serves as Director of Technology for NANIUM in Portugal since 2010. He is active member and co-chair of several SEMI, IEEE, IMAPS and SMTA technical committees. In 2016 he was elected to chair the European SEMI integrated Packaging and Test Special Interest Group ESiPAT. In his 19 years in the semiconductor industry, he has held various engineering and management positions at Siemens, Infineon Technologies, Qimonda and NANIUM in Germany and Portugal. Steffen received his Master of Science degree in Electrical Engineering and Microsystems Technologies from the Technical University of Chemnitz, Germany, in 1997.


Contributing Editor - Reliability

Ephraim Suhir received his MS from the Polytechnic Institute, Odessa, Ukraine, and PhD from Moscow State U. Among his honors, he is a Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, Institute of Electrical and Electronics Engineers (IEEE), and the International Microelectronics and Packaging Society (IMAPS). He is affiliated with Portland State U. and ERS Co