Chip Scale Review is the leading global magazine going into its 18th year covering device and wafer-level test, assembly, and packaging. While holding true to its founding mission, as packaging has evolved, so too has Chip Scale Review, which now also covers high-density interconnection technologies including 3D packages, MEMS, and other wafer-fabricated devices. We are proud to be part of an industry that has been responsible for many of the major technological breakthroughs since the “birth” of the integrated circuit.
Chip Scale Review is the first word in middle-end and back-end technologies for advanced semiconductors! CSR showcases industry leaders with exclusive editorial content that includes in-depth technical articles by leading industry technologists, market forecasts and updates from veteran industry analysts, research institutions, industry news, events and reviews. Also featured are international directories of equipment manufacturers, materials suppliers and service providers.
New for 2015, are the recently announced Tech Briefs section exclusively written inhouse by CSR’s senior technical editor.